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MT57W1MH18JF-5
Micron Technology Inc
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Check for Price | No | Transferred | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | 200 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 170 mA | 1.7 V | 250 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 70 °C | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | MICRON TECHNOLOGY INC | BGA | 13 X 15 MM, 1 MM PITCH, FBGA-165 | 165 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||
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MT57W1MH18JF-5
Rochester Electronics LLC
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Check for Price | Active | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | DDR SRAM | PIPELINED ARCHITECTURE | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | PARALLEL | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | COMMERCIAL | e1 | 70 °C | 165 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | ROCHESTER ELECTRONICS LLC | BGA | 13 X 15 MM, 1 MM PITCH, FBGA-165 | 165 | unknown | ||||||||||||||||
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MT57W1MH18JF-5
Cypress Semiconductor
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Check for Price | No | No | Obsolete | 18.8744 Mbit | 18 | 1MX18 | 1.8 V | 450 ps | DDR SRAM | PIPELINED ARCHITECTURE | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | PARALLEL | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | TBGA, | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 |