Findchips: Parametric Search Results for MT57W1MH18BF-3


Select Parts		Part Number

		MT57W1MH18BF-3.3 Micron Technology Inc
		MT57W1MH18BF-3 Micron Technology Inc
		MT57W1MH18BF-3.3 Cypress Semiconductor
		MT57W1MH18BF-3 Cypress Semiconductor

				Most Relevant						Technical																Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

18.8744 Mbit

1MX18

1.8 V

450 ps

303 MHz

DDR SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

235 mA

1.7 V

475 µA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

MICRON TECHNOLOGY INC

BGA

13 X 15 MM, 1 MM PITCH, FBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

18.8744 Mbit

1MX18

1.8 V

450 ps

333 MHz

DDR SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

255 mA

1.7 V

525 µA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

MICRON TECHNOLOGY INC

BGA

13 X 15 MM, 1 MM PITCH, FBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

450 ps

DDR SRAM

PIPELINED ARCHITECTURE

1000000

1.0486 M

SYNCHRONOUS

PARALLEL

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

NOT SPECIFIED

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

450 ps

DDR SRAM

PIPELINED ARCHITECTURE

1000000

1.0486 M

SYNCHRONOUS

PARALLEL

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

NOT SPECIFIED

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

Compare

MT57W1MH18BF-3.3

Micron Technology Inc

Check for Price

Transferred

18.8744 Mbit

1MX18

1.8 V

450 ps

303 MHz

DDR SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

235 mA

1.7 V

475 µA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

MICRON TECHNOLOGY INC

BGA

13 X 15 MM, 1 MM PITCH, FBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

MT57W1MH18BF-3

Micron Technology Inc

Check for Price

Transferred

18.8744 Mbit

1MX18

1.8 V

450 ps

333 MHz

DDR SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

255 mA

1.7 V

525 µA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

MICRON TECHNOLOGY INC

BGA

13 X 15 MM, 1 MM PITCH, FBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

MT57W1MH18BF-3.3

Cypress Semiconductor

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

450 ps

DDR SRAM

PIPELINED ARCHITECTURE

1000000

1.0486 M

SYNCHRONOUS

PARALLEL

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

NOT SPECIFIED

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

MT57W1MH18BF-3

Cypress Semiconductor

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

450 ps

DDR SRAM

PIPELINED ARCHITECTURE

1000000

1.0486 M

SYNCHRONOUS

PARALLEL

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

NOT SPECIFIED

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: MT57W1MH18BF-3 under SRAMs