Findchips: Parametric Search Results for MT47H32M16BN-37E

Parametric results for: MT47H32M16BN-37E under DRAMs

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Select Parts		Part Number

		MT47H32M16BN-37EL Micron Technology Inc
		MT47H32M16BN-37ELIT:D Micron Technology Inc
		MT47H32M16BN-37EIT:D Micron Technology Inc
		MT47H32M16BN-37EIT Micron Technology Inc
		MT47H32M16BN-37E:D Micron Technology Inc
		MT47H32M16BN-37ELAT:D Micron Technology Inc
		MT47H32M16BN-37EAT:D Micron Technology Inc
		MT47H32M16BN-37EL:D Micron Technology Inc
		MT47H32M16BN-37E Micron Technology Inc
		MT47H32M16BN-37ELIT Micron Technology Inc

				Most Relevant								Technical																		Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Refresh Cycles	Access Mode	Memory IC Type	Additional Feature	I/O Type	Interleaved Burst Length	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Self Refresh	Sequential Burst Length	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

267 MHz

8192

DDR2 DRAM

COMMON

4,8

32000000

33.5544 M

3-STATE

4,8

7 mA

CMOS

R-PBGA-B84

Not Qualified

PLASTIC/EPOXY

FBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

MATTE TIN

BALL

800 µm

BOTTOM

MICRON TECHNOLOGY INC

FBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.28

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

266 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

340 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

10 mm

MICRON TECHNOLOGY INC

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.28

BGA

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

266 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

340 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

10 mm

MICRON TECHNOLOGY INC

TFBGA, BGA84,9X15,32

not_compliant

EAR99

8542.32.00.28

BGA

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

267 MHz

8192

DDR2 DRAM

COMMON

4,8

32000000

33.5544 M

3-STATE

4,8

7 mA

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

MATTE TIN

BALL

800 µm

BOTTOM

MICRON TECHNOLOGY INC

FBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.28

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

266 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

340 µA

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B84

Not Qualified

85 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

10 mm

MICRON TECHNOLOGY INC

10 X 12.50 MM, ROHS COMPLIANT, FBGA-84

unknown

EAR99

8542.32.00.28

BGA

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

500 ps

266 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

340 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY

YES

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

10 mm

MICRON TECHNOLOGY INC

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.32

BGA

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

266 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

340 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

10 mm

MICRON TECHNOLOGY INC

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.28

BGA

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

266 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

340 µA

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B84

Not Qualified

85 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

10 mm

MICRON TECHNOLOGY INC

TFBGA, BGA84,9X15,32

unknown

EAR99

8542.32.00.28

BGA

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

267 MHz

8192

DDR2 DRAM

COMMON

4,8

32000000

33.5544 M

3-STATE

4,8

7 mA

CMOS

R-PBGA-B84

Not Qualified

PLASTIC/EPOXY

FBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

MATTE TIN

BALL

800 µm

BOTTOM

MICRON TECHNOLOGY INC

FBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.28

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

267 MHz

8192

DDR2 DRAM

COMMON

4,8

32000000

33.5544 M

3-STATE

4,8

7 mA

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

MATTE TIN

BALL

800 µm

BOTTOM

MICRON TECHNOLOGY INC

FBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.28

Compare

MT47H32M16BN-37EL

Micron Technology Inc

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

267 MHz

8192

DDR2 DRAM

COMMON

4,8

32000000

33.5544 M

3-STATE

4,8

7 mA

CMOS

R-PBGA-B84

Not Qualified

PLASTIC/EPOXY

FBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

MATTE TIN

BALL

800 µm

BOTTOM

MICRON TECHNOLOGY INC

FBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.28

MT47H32M16BN-37ELIT:D

Micron Technology Inc

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

266 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

340 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

10 mm

MICRON TECHNOLOGY INC

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.28

BGA

MT47H32M16BN-37EIT:D

Micron Technology Inc

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

266 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

340 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

10 mm

MICRON TECHNOLOGY INC

TFBGA, BGA84,9X15,32

not_compliant

EAR99

8542.32.00.28

BGA

MT47H32M16BN-37EIT

Micron Technology Inc

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

267 MHz

8192

DDR2 DRAM

COMMON

4,8

32000000

33.5544 M

3-STATE

4,8

7 mA

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

MATTE TIN

BALL

800 µm

BOTTOM

MICRON TECHNOLOGY INC

FBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.28

MT47H32M16BN-37E:D

Micron Technology Inc

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

266 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

340 µA

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B84

Not Qualified

85 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

10 mm

MICRON TECHNOLOGY INC

10 X 12.50 MM, ROHS COMPLIANT, FBGA-84

unknown

EAR99

8542.32.00.28

BGA

MT47H32M16BN-37ELAT:D

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

64MX16

1.8 V

500 ps

266 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

64000000

67.1089 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

340 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY

YES

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

10 mm

MICRON TECHNOLOGY INC

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.32

BGA

MT47H32M16BN-37EAT:D

Micron Technology Inc

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

266 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

340 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

10 mm

MICRON TECHNOLOGY INC

TFBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.28

BGA

MT47H32M16BN-37EL:D

Micron Technology Inc

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

266 MHz

8192

FOUR BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

32000000

33.5544 M

SYNCHRONOUS

3-STATE

YES

4,8

7 mA

340 µA

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B84

Not Qualified

85 °C

PLASTIC/EPOXY

TFBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

10 mm

MICRON TECHNOLOGY INC

TFBGA, BGA84,9X15,32

unknown

EAR99

8542.32.00.28

BGA

MT47H32M16BN-37E

Micron Technology Inc

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

267 MHz

8192

DDR2 DRAM

COMMON

4,8

32000000

33.5544 M

3-STATE

4,8

7 mA

CMOS

R-PBGA-B84

Not Qualified

PLASTIC/EPOXY

FBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

MATTE TIN

BALL

800 µm

BOTTOM

MICRON TECHNOLOGY INC

FBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.28

MT47H32M16BN-37ELIT

Micron Technology Inc

Check for Price

Yes

Obsolete

536.8709 Mbit

32MX16

1.8 V

500 ps

267 MHz

8192

DDR2 DRAM

COMMON

4,8

32000000

33.5544 M

3-STATE

4,8

7 mA

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

MATTE TIN

BALL

800 µm

BOTTOM

MICRON TECHNOLOGY INC

FBGA, BGA84,9X15,32

compliant

EAR99

8542.32.00.28