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MT45W4MW16BBB-708IT
Micron Technology Inc
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 1.8 V | 70 ns | PSEUDO STATIC RAM | SYNCHRONOUS BURST MODE POSSIBLE | COMMON | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 120 µA | 35 µA | 1.95 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B54 | Not Qualified | e1 | 85 °C | -40 °C | 260 | 54 | PLASTIC/EPOXY | VFBGA | BGA54,6X9,30 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 750 µm | BOTTOM | 1 mm | 8 mm | 6 mm | MICRON TECHNOLOGY INC | BGA | VFBGA, BGA54,6X9,30 | 54 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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MT45W4MW16BBB708IT
Micron Technology Inc
|
Check for Price | Yes | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 1.8 V | 70 ns | PSEUDO STATIC RAM | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 1.95 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B54 | Not Qualified | e1 | 85 °C | -40 °C | 260 | 30 | 54 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 750 µm | BOTTOM | 1 mm | 8 mm | 6 mm | MICRON TECHNOLOGY INC | BGA | 6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, LEAD FREE, VFBGA-54 | 54 | compliant |