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MT29F256G08CJAABH3-12:A
Micron Technology Inc
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Check for Price | Yes | Yes | Active | 274.8779 Gbit | 8 | 32GX8 | 3.3 V | FLASH | 1 | 32000000000 | 34.3597 G | SYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | COMMERCIAL | MLC NAND TYPE | R-PBGA-B100 | e1 | 70 °C | 100 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 18 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | 12 X 18 MM, 1.40 MM HEIGHT, LEAD FREE, LBGA-100 | 100 | compliant | EAR99 | 8542.32.00.51 | |||||
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MT29F256G08CJAABH1-12Z:A
Micron Technology Inc
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Check for Price | Yes | Yes | Active | 274.8779 Gbit | 8 | 32GX8 | 3.3 V | FLASH | 1 | 32000000000 | 34.3597 G | SYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | COMMERCIAL | MLC NAND TYPE | R-PBGA-B100 | e1 | 70 °C | 100 | PLASTIC/EPOXY | VBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1 mm | 18 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | 12 X 18 MM, 1 MM HEIGHT, LEAD FREE, VBGA-100 | 100 | compliant | EAR99 | 8542.32.00.51 | |||||
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MT29F256G08CJAABH1-10ITZ:A
Micron Technology Inc
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Check for Price | Yes | Yes | Active | 274.8779 Gbit | 8 | 32GX8 | 3.3 V | FLASH | 1 | 32000000000 | 34.3597 G | SYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | MLC NAND TYPE | R-PBGA-B100 | e1 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | VBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1 mm | 18 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | 12 X 18 MM, 1 MM HEIGHT, LEAD FREE, VBGA-100 | 100 | compliant | EAR99 | 8542.32.00.51 | ||||
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MT29F256G08CJAABH1-12IT:A
Micron Technology Inc
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Check for Price | Yes | Yes | Active | 274.8779 Gbit | 8 | 32GX8 | 3.3 V | FLASH | 1 | 32000000000 | 34.3597 G | SYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | MLC NAND TYPE | R-PBGA-B100 | e1 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | VBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1 mm | 18 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | VBGA, | 100 | compliant | EAR99 | 8542.32.00.51 | ||||
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MT29F256G08CJAABH1-12ITZ:A
Micron Technology Inc
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Check for Price | Yes | Yes | Active | 274.8779 Gbit | 8 | 32GX8 | 3.3 V | FLASH | 1 | 32000000000 | 34.3597 G | SYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | MLC NAND TYPE | R-PBGA-B100 | e1 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | VBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1 mm | 18 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | 12 X 18 MM, 1 MM HEIGHT, LEAD FREE, VBGA-100 | 100 | compliant | EAR99 | 8542.32.00.51 | ||||
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MT29F256G08CJAABH3-12IT:A
Micron Technology Inc
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Check for Price | Yes | Yes | Active | 274.8779 Gbit | 8 | 32GX8 | 3.3 V | FLASH | 1 | 32000000000 | 34.3597 G | SYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | MLC NAND TYPE | R-PBGA-B100 | e1 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 18 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | 12 X 18 MM, 1.40 MM HEIGHT, LEAD FREE, LBGA-100 | 100 | compliant | EAR99 | 8542.32.00.51 | ||||
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MT29F256G08CJAABH3-10:A
Micron Technology Inc
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Check for Price | Yes | Yes | Active | 274.8779 Gbit | 8 | 32GX8 | 3.3 V | FLASH | 1 | 32000000000 | 34.3597 G | SYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | COMMERCIAL | MLC NAND TYPE | R-PBGA-B100 | e1 | 70 °C | 100 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 18 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | 12 X 18 MM, 1.40 MM HEIGHT, LEAD FREE, LBGA-100 | 100 | compliant | EAR99 | 8542.32.00.51 | |||||
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MT29F256G08CJAABWP-10ITZ:A
Micron Technology Inc
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Check for Price | Yes | Yes | Active | 274.8779 Gbit | 8 | 32GX8 | 3.3 V | FLASH | 1 | 32000000000 | 34.3597 G | SYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | MLC NAND TYPE | R-PDSO-G48 | e3 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | MICRON TECHNOLOGY INC | TSOP1 | TSOP1, | 48 | compliant | EAR99 | 8542.32.00.51 | ||||
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MT29F256G08CJAABC5-12ITZ:A
Micron Technology Inc
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Check for Price | Yes | Yes | Active | 274.8779 Gbit | 8 | 32GX8 | 3.3 V | FLASH | 1 | 32000000000 | 34.3597 G | SYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | MLC NAND TYPE | R-PBGA-B52 | 85 °C | -40 °C | 260 | 30 | 52 | PLASTIC/EPOXY | VFLGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BUTT | BOTTOM | 1 mm | 18 mm | 14 mm | MICRON TECHNOLOGY INC | LGA | 14 X 18 MM, 1 MM HEIGHT, PLASTIC, LEAD FREE, VLGA-52 | 52 | compliant | EAR99 | 8542.32.00.51 | |||||
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MT29F256G08CJAABH2-10IT:A
Micron Technology Inc
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Check for Price | Yes | Yes | Active | 274.8779 Gbit | 8 | 32GX8 | 3.3 V | FLASH | 1 | 32000000000 | 34.3597 G | SYNCHRONOUS | PARALLEL | 2.7 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | MLC NAND TYPE | R-PBGA-B100 | e1 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 18 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | TBGA, | 100 | compliant | EAR99 | 8542.32.00.51 |