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MSP1N3033BUR-1TR
Microsemi Corporation
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Check for Price | No | Obsolete | 7 mA | 1.25 W | 36 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AB | O-LELF-R2 | 2 | unknown | EAR99 | 8541.10.00.50 | ||
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MSP1N3033BUR-1E3
Microsemi Corporation
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Check for Price | Yes | Obsolete | 7 mA | 1.25 W | 36 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 5 % | Not Qualified | O-LELF-R2 | e3 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WRAP AROUND | END | MICROSEMI CORP | DO-213AB | O-LELF-R2 | 2 | unknown | EAR99 | 8541.10.00.50 | ||
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MSP1N3033BUR-1E3TR
Microsemi Corporation
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Check for Price | Yes | Obsolete | 7 mA | 1.25 W | 36 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 5 % | Not Qualified | O-LELF-R2 | e3 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WRAP AROUND | END | MICROSEMI CORP | DO-213AB | O-LELF-R2 | 2 | unknown | EAR99 | 8541.10.00.50 | ||
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MSP1N3033BUR-1
Microsemi Corporation
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Check for Price | No | Obsolete | 7 mA | 1.25 W | 36 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AB | O-LELF-R2 | 2 | unknown | EAR99 | 8541.10.00.50 |