Parametric results for: MR25H256 under Other Memory ICs
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MR25H256CDC
Everspin Technologies
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$3.8942 | Yes | Not Recommended | 262.144 kbit | 8 | 32KX8 | 3 V | MEMORY CIRCUIT | 1 | 32000 | 32.768 k | SYNCHRONOUS | 10 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-N8 | Not Qualified | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | HSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG | YES | NO LEAD | 1.27 mm | DUAL | 1.05 mm | 6 mm | 5 mm | EVERSPIN TECHNOLOGIES INC | SON | HSON, SOLCC8,.25 | 8 | compliant | EAR99 | 8542.32.00.71 | Everspin Technologies | |||||
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MR25H256ACDFR
Everspin Technologies
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Check for Price | Yes | Active | 262.144 kbit | 8 | 32KX8 | 3 V | SPI BUS SERIAL EEPROM | 1 | 32000 | 32.768 k | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-N8 | 3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 900 µm | 6 mm | 5 mm | EVERSPIN TECHNOLOGIES INC | HVSON, | compliant | EAR99 | 8542.32.00.71 | Everspin Technologies | ||||||||||||
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MR25H256CDF
Everspin Technologies
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Check for Price | Yes | Not Recommended | 262.144 kbit | 8 | 32KX8 | 3 V | MEMORY CIRCUIT | 1 | 32000 | 32.768 k | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-N8 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 900 µm | 6 mm | 5 mm | EVERSPIN TECHNOLOGIES INC | HVSON, | compliant | EAR99 | 8542.32.00.71 | Everspin Technologies | ||||||||
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MR25H256MDFR
Everspin Technologies
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Check for Price | Yes | Not Recommended | 262.144 kbit | 8 | 32KX8 | 3.3 V | MEMORY CIRCUIT | 1 | 32000 | 32.768 k | SYNCHRONOUS | 3.6 V | 3 V | CMOS | AUTOMOTIVE | R-PDSO-N8 | e3 | 3 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 1.27 mm | DUAL | 900 µm | 6 mm | 5 mm | EVERSPIN TECHNOLOGIES INC | SON | HVSON, | 8 | compliant | EAR99 | 8542.32.00.71 | Everspin Technologies | |||||
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MR25H256MDF
Everspin Technologies
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Check for Price | Yes | Not Recommended | 262.144 kbit | 8 | 32KX8 | 3.3 V | MEMORY CIRCUIT | 1 | 32000 | 32.768 k | SYNCHRONOUS | 3.6 V | 3 V | CMOS | AUTOMOTIVE | R-PDSO-N8 | e3 | 3 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 900 µm | 6 mm | 5 mm | EVERSPIN TECHNOLOGIES INC | SON | DFN-8 | 8 | compliant | EAR99 | 8542.32.00.71 | Everspin Technologies | |||||
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MR25H256CDCR
Everspin Technologies
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Check for Price | Yes | Not Recommended | 262.144 kbit | 8 | 32KX8 | 3 V | MEMORY CIRCUIT | 1 | 32000 | 32.768 k | SYNCHRONOUS | 10 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-N8 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG | YES | NO LEAD | 1.27 mm | DUAL | 1.05 mm | 6 mm | 5 mm | EVERSPIN TECHNOLOGIES INC | SON | HSON, SOLCC8,.25 | 8 | compliant | EAR99 | 8542.32.00.71 | Everspin Technologies | |||||
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MR25H256APDF
Everspin Technologies
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Check for Price | Yes | Active | 262.144 kbit | 8 | 32KX8 | 3 V | SPI BUS SERIAL EEPROM | 1 | 32000 | 32.768 k | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-N8 | 3 | 85 °C | -40 °C | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 900 µm | 6 mm | 5 mm | EVERSPIN TECHNOLOGIES INC | HVSON, | compliant | EAR99 | 8542.32.00.71 | Everspin Technologies | |||||||||
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MR25H256MDC
Everspin Technologies
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Check for Price | Yes | Not Recommended | 262.144 kbit | 8 | 32KX8 | 3.3 V | MEMORY CIRCUIT | 1 | 32000 | 32.768 k | SYNCHRONOUS | 10 µA | 3.6 V | 3 V | CMOS | AUTOMOTIVE | R-PDSO-N8 | Not Qualified | 125 °C | -40 °C | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | HSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG | YES | NO LEAD | 1.27 mm | DUAL | 1.05 mm | 6 mm | 5 mm | EVERSPIN TECHNOLOGIES INC | SON | HSON, SOLCC8,.25 | 8 | compliant | EAR99 | 8542.32.00.71 | Everspin Technologies | |||||
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MR25H256AMDFR
Everspin Technologies
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Check for Price | Yes | Active | 262.144 kbit | 8 | 32KX8 | 3.3 V | SPI BUS SERIAL EEPROM | 1 | 32000 | 32.768 k | SYNCHRONOUS | 3.6 V | 3 V | CMOS | AUTOMOTIVE | R-PDSO-N8 | 3 | 125 °C | -40 °C | AEC-Q100 | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 900 µm | 6 mm | 5 mm | EVERSPIN TECHNOLOGIES INC | HVSON, | compliant | EAR99 | 8542.32.00.71 | Everspin Technologies | |||||||||||
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MR25H256ACDF
Everspin Technologies
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Check for Price | Yes | Active | 262.144 kbit | 8 | 32KX8 | 3 V | SPI BUS SERIAL EEPROM | 1 | 32000 | 32.768 k | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-N8 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 900 µm | 6 mm | 5 mm | EVERSPIN TECHNOLOGIES INC | HVSON, | compliant | EAR99 | 8542.32.00.71 | Everspin Technologies |