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Parametric results for: MPC885ZP66 under Microprocessors

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Manufacturer Part Number: mpc885zp66
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MPC885ZP66
 NXP Semiconductors 		Check for Price No Obsolete 32 66 MHz 32 32 YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.9 V 1.7 V S-PBGA-B357 Not Qualified e0 3 245 30 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm NXP SEMICONDUCTORS PLASTIC, BGA-357 unknown 5A002.A.1 8542.31.00.01
KMPC885ZP66
 Freescale Semiconductor 		Check for Price No No Transferred 32 66 MHz 32 32 YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.9 V 1.7 V S-PBGA-B357 Not Qualified e0 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm FREESCALE SEMICONDUCTOR INC PLASTIC, BGA-357 compliant 8542.31.00.01 BGA 357
MPC885ZP66
 Motorola Mobility LLC 		Check for Price Transferred 32 66 MHz 32 32 YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.9 V 1.7 V S-PBGA-B357 Not Qualified 357 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm MOTOROLA INC BGA, unknown 8542.31.00.01 BGA 357
MPC885ZP66
 Freescale Semiconductor 		Check for Price No No Transferred 32 66 MHz 32 32 YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.9 V 1.7 V S-PBGA-B357 Not Qualified e0 3 245 30 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm FREESCALE SEMICONDUCTOR INC PLASTIC, BGA-357 not_compliant 5A002 8542.31.00.01 BGA 357
MPC885ZP66
 Motorola Semiconductor Products 		Check for Price No Transferred 32 66 MHz 32 32 YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.9 V 1.7 V S-PBGA-B357 Not Qualified 357 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm MOTOROLA INC 25 X 25 MM, 1.27 MM PITCH, PLASTIC, MS-034BAK-1, BGA-357 unknown 8542.31.00.01
KMPC885ZP66
 NXP Semiconductors 		Check for Price No Active 32 66 MHz 32 32 YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.9 V 1.7 V S-PBGA-B357 Not Qualified e0 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm NXP SEMICONDUCTORS BGA, BGA357,19X19,50 unknown 8542.31.00.01