Filter Your Search
1 - 10 of 55 results
Select Parts | Part Number |
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MPC862PZP100B
Freescale Semiconductor
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MPC862PCZQ66B
Freescale Semiconductor
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MPC862PCZP66B
Freescale Semiconductor
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MPC862TCVR50B
Freescale Semiconductor
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MPC862PZQ66B
NXP Semiconductors
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MPC862TVR80B
Freescale Semiconductor
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MPC862TVR100B
Freescale Semiconductor
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MPC862TZP80B
Freescale Semiconductor
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MPC862PZP80B
NXP Semiconductors
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MPC862PZP50B
Freescale Semiconductor
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Bit Size | Speed |
External Data Bus Width
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Address Bus Width |
Clock Frequency-Max
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Surface Mount
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Supply Voltage-Nom |
uPs/uCs/Peripheral ICs Type
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Technology |
Boundary Scan
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Format
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Integrated Cache
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Low Power Mode
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Supply Voltage-Max
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Supply Voltage-Min
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Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Width
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Length
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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ECCN Code
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HTS Code
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Transferred | 32 | 100 MHz | 32 | 32 | 33 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 3.465 V | 3.135 V | OTHER | S-PBGA-B357 | Not Qualified | 105 °C | 357 | PLASTIC/EPOXY | BGA | BGA357,19X19,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2.05 mm | 25 mm | 25 mm | FREESCALE SEMICONDUCTOR INC | BGA | PLASTIC, BGA-357 | 357 | compliant | 3A991.A.2 | 8542.31.00.01 | |||||||||
No | No | Transferred | 32 | 100 MHz | 32 | 32 | 33 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.465 V | 3.135 V | S-PBGA-B357 | e0 | 3 | 245 | 30 | 357 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.05 mm | 25 mm | 25 mm | FREESCALE SEMICONDUCTOR INC | BGA | PLASTIC, BGA-357 | 357 | not_compliant | 3A991.A.2 | 8542.31.00.01 | ||||||
Transferred | 32 | 66 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | INDUSTRIAL | S-PBGA-B357 | Not Qualified | 115 °C | -40 °C | 357 | PLASTIC/EPOXY | BGA | BGA357,19X19,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | FREESCALE SEMICONDUCTOR INC | unknown | 8542.31.00.01 | |||||||||||||||||||||||||
Yes | Transferred | 32 | 50 MHz | 32 | 32 | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.465 V | 3.135 V | INDUSTRIAL | S-PBGA-B357 | e1 | 3 | 105 °C | -40 °C | 245 | 30 | 357 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1.27 mm | BOTTOM | 2.52 mm | 25 mm | 25 mm | FREESCALE SEMICONDUCTOR INC | BGA-357 | compliant | |||||||||
No | Obsolete | 32 | 66 MHz | 32 | 32 | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.465 V | 3.135 V | OTHER | S-PBGA-B357 | e0 | 3 | 105 °C | 245 | 30 | 357 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 2.52 mm | 25 mm | 25 mm | NXP SEMICONDUCTORS | BGA-357 | unknown | 5A991 | 8542.31.00.01 | ||||||||
Yes | Yes | Transferred | 32 | 80 MHz | 32 | 32 | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.465 V | 3.135 V | OTHER | S-PBGA-B357 | e1 | 3 | 105 °C | 245 | 30 | 357 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1.27 mm | BOTTOM | 2.52 mm | 25 mm | 25 mm | FREESCALE SEMICONDUCTOR INC | BGA-357 | compliant | 3A991.A.2 | 8542.31.00.01 | |||||||
Yes | Transferred | 32 | 100 MHz | 32 | 32 | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.465 V | 3.135 V | OTHER | S-PBGA-B357 | e1 | 3 | 105 °C | 245 | 30 | 357 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1.27 mm | BOTTOM | 2.52 mm | 25 mm | 25 mm | FREESCALE SEMICONDUCTOR INC | BGA-357 | compliant | ||||||||||
Transferred | 32 | 80 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | OTHER | S-PBGA-B357 | Not Qualified | 105 °C | 357 | PLASTIC/EPOXY | BGA | BGA357,19X19,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | FREESCALE SEMICONDUCTOR INC | BGA, BGA357,19X19,50 | unknown | 8542.31.00.01 | |||||||||||||||||||||||||
Active | 32 | 80 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | OTHER | S-PBGA-B357 | Not Qualified | 105 °C | 357 | PLASTIC/EPOXY | BGA | BGA357,19X19,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | NXP SEMICONDUCTORS | BGA, BGA357,19X19,50 | compliant | 8542.31.00.01 | |||||||||||||||||||||||||
Transferred | 32 | 50 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | OTHER | S-PBGA-B357 | Not Qualified | 105 °C | 357 | PLASTIC/EPOXY | BGA | BGA357,19X19,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | FREESCALE SEMICONDUCTOR INC | BGA, BGA357,19X19,50 | unknown | 8542.31.00.01 |
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MPC862PZP100B
Freescale Semiconductor
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Check for Price Buy | Transferred | 32 | 100 MHz | 32 | 32 | 33 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 3.465 V | 3.135 V | OTHER | S-PBGA-B357 | Not Qualified | 105 °C | 357 | PLASTIC/EPOXY | BGA | BGA357,19X19,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2.05 mm | 25 mm | 25 mm | FREESCALE SEMICONDUCTOR INC | BGA | PLASTIC, BGA-357 | 357 | compliant | 3A991.A.2 | 8542.31.00.01 | ||||||||||
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MPC862PCZQ66B
Freescale Semiconductor
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Check for Price Buy | No | No | Transferred | 32 | 100 MHz | 32 | 32 | 33 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.465 V | 3.135 V | S-PBGA-B357 | e0 | 3 | 245 | 30 | 357 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | TIN LEAD | BALL | 1.27 mm | BOTTOM | 2.05 mm | 25 mm | 25 mm | FREESCALE SEMICONDUCTOR INC | BGA | PLASTIC, BGA-357 | 357 | not_compliant | 3A991.A.2 | 8542.31.00.01 | |||||||
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MPC862PCZP66B
Freescale Semiconductor
|
Check for Price Buy | Transferred | 32 | 66 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | INDUSTRIAL | S-PBGA-B357 | Not Qualified | 115 °C | -40 °C | 357 | PLASTIC/EPOXY | BGA | BGA357,19X19,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | FREESCALE SEMICONDUCTOR INC | unknown | 8542.31.00.01 | ||||||||||||||||||||||||||
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MPC862TCVR50B
Freescale Semiconductor
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Check for Price Buy | Yes | Transferred | 32 | 50 MHz | 32 | 32 | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.465 V | 3.135 V | INDUSTRIAL | S-PBGA-B357 | e1 | 3 | 105 °C | -40 °C | 245 | 30 | 357 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1.27 mm | BOTTOM | 2.52 mm | 25 mm | 25 mm | FREESCALE SEMICONDUCTOR INC | BGA-357 | compliant | ||||||||||
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MPC862PZQ66B
NXP Semiconductors
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Check for Price Buy | No | Obsolete | 32 | 66 MHz | 32 | 32 | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.465 V | 3.135 V | OTHER | S-PBGA-B357 | e0 | 3 | 105 °C | 245 | 30 | 357 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 2.52 mm | 25 mm | 25 mm | NXP SEMICONDUCTORS | BGA-357 | unknown | 5A991 | 8542.31.00.01 | |||||||||
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MPC862TVR80B
Freescale Semiconductor
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Check for Price Buy | Yes | Yes | Transferred | 32 | 80 MHz | 32 | 32 | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.465 V | 3.135 V | OTHER | S-PBGA-B357 | e1 | 3 | 105 °C | 245 | 30 | 357 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1.27 mm | BOTTOM | 2.52 mm | 25 mm | 25 mm | FREESCALE SEMICONDUCTOR INC | BGA-357 | compliant | 3A991.A.2 | 8542.31.00.01 | ||||||||
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MPC862TVR100B
Freescale Semiconductor
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Check for Price Buy | Yes | Transferred | 32 | 100 MHz | 32 | 32 | YES | 3.3 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 3.465 V | 3.135 V | OTHER | S-PBGA-B357 | e1 | 3 | 105 °C | 245 | 30 | 357 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1.27 mm | BOTTOM | 2.52 mm | 25 mm | 25 mm | FREESCALE SEMICONDUCTOR INC | BGA-357 | compliant | |||||||||||
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MPC862TZP80B
Freescale Semiconductor
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Check for Price Buy | Transferred | 32 | 80 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | OTHER | S-PBGA-B357 | Not Qualified | 105 °C | 357 | PLASTIC/EPOXY | BGA | BGA357,19X19,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | FREESCALE SEMICONDUCTOR INC | BGA, BGA357,19X19,50 | unknown | 8542.31.00.01 | ||||||||||||||||||||||||||
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MPC862PZP80B
NXP Semiconductors
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Check for Price Buy | Active | 32 | 80 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | OTHER | S-PBGA-B357 | Not Qualified | 105 °C | 357 | PLASTIC/EPOXY | BGA | BGA357,19X19,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | NXP SEMICONDUCTORS | BGA, BGA357,19X19,50 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||||
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MPC862PZP50B
Freescale Semiconductor
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Check for Price Buy | Transferred | 32 | 50 MHz | YES | 3.3 V | MICROPROCESSOR, RISC | OTHER | S-PBGA-B357 | Not Qualified | 105 °C | 357 | PLASTIC/EPOXY | BGA | BGA357,19X19,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | FREESCALE SEMICONDUCTOR INC | BGA, BGA357,19X19,50 | unknown | 8542.31.00.01 |