Findchips: Parametric Search Results for MPC860DECVR50D4


Select Parts		Part Number

		MPC860DECVR50D4 NXP Semiconductors
		MPC860DECVR50D4 Freescale Semiconductor

				Most Relevant							Technical								Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$84.2047

Yes

Obsolete

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

S-PBGA-B357

Not Qualified

245

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

Check for Price

Yes

Transferred

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

S-PBGA-B357

245

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

BGA

357

Compare

MPC860DECVR50D4

NXP Semiconductors

$84.2047

Yes

Obsolete

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

S-PBGA-B357

Not Qualified

245

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

MPC860DECVR50D4

Freescale Semiconductor

Check for Price

Yes

Transferred

50 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

S-PBGA-B357

245

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

BGA

357

Parametric results for: MPC860DECVR50D4 under Microprocessors