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Parametric results for: MPC8313 under Microprocessors

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Manufacturer Part Number: mpc8313
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MPC8313CVRADDC
 NXP Semiconductors 		$8.5697 Yes Not Recommended 32 266 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.05 V 950 mV INDUSTRIAL S-PBGA-B516 Not Qualified e2 3 105 °C -40 °C 260 40 516 PLASTIC/EPOXY BGA BGA516,26X26,40 SQUARE GRID ARRAY Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGAII-516 compliant 3A991.A.2 8542.31.00.01 NXP
MPC8313VRAFFC
 Freescale Semiconductor 		$15.7486 Yes Yes Transferred 32 333 MHz 133 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B516 Not Qualified e2 3 105 °C 260 40 516 PLASTIC/EPOXY BGA BGA516,26X26,40 SQUARE GRID ARRAY TIN SILVER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGA-516 compliant 3A991.A.2 8542.31.00.01 NXP BGA 516
MPC8313ZQAFFC
 NXP Semiconductors 		$18.1827 No Obsolete 32 333 MHz 32 15 YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B516 Not Qualified e0 3 105 °C 260 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEBGAII-516 unknown 3A991.A.2 8542.31.00.01 NXP
MPC8313ZQADDC
 NXP Semiconductors 		$21.1820 No Obsolete 266 MHz 32 15 YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B516 e0 3 105 °C 260 40 516 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEBGAII-516 unknown 3A991.A.2 8542.31.00.01
MPC8313CVRAFFC
 Freescale Semiconductor 		$22.3000 Yes Yes Transferred 32 333 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR CMOS ALSO REQUIRES 3.3V I/O SUPPLY YES FLOATING POINT YES YES 1.5 V 950 mV S-PBGA-B516 e2 3 260 40 516 PLASTIC/EPOXY BGA SQUARE GRID ARRAY Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516 compliant 3A991.A.2 8542.31.00.01 NXP BGA 516
MPC8313EZQADDC
 NXP Semiconductors 		$23.3240 No Obsolete 266 MHz 32 15 YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B516 e0 3 105 °C 260 40 516 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS HBGA, unknown 5A002.A.1 8542.31.00.01
MPC8313VRADDC
 NXP Semiconductors 		$24.0745 Yes Not Recommended 32 266 MHz 66.67 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B516 Not Qualified e2 3 105 °C 260 40 516 PLASTIC/EPOXY BGA BGA516,26X26,40 SQUARE GRID ARRAY Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGAII-516 compliant 3A991.A.2 8542.31.00.01 NXP
MPC8313CZQADDC
 NXP Semiconductors 		$24.3780 No Obsolete 266 MHz 32 15 YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV INDUSTRIAL S-PBGA-B516 e0 3 105 °C -40 °C 260 40 516 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS TEBGAII-516 unknown 3A991.A.2 8542.31.00.01
MPC8313VRAFFC
 NXP Semiconductors 		$24.4917 Yes Not Recommended 32 333 MHz 133 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B516 Not Qualified e2 3 105 °C 260 40 516 PLASTIC/EPOXY BGA BGA516,26X26,40 SQUARE GRID ARRAY Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm NXP SEMICONDUCTORS 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGA-516 compliant 3A991.A.2 8542.31.00.01 NXP
MPC8313EVRAFFB
 Freescale Semiconductor 		$26.4744 Yes Obsolete 32 333 MHz 32 32 66.67 MHz YES 1 V MICROPROCESSOR CMOS ALSO REQUIRES 3.3V I/O SUPPLY YES FLOATING POINT YES YES 1.5 V 950 mV OTHER S-PBGA-B516 Not Qualified e2 3 105 °C 260 40 516 PLASTIC/EPOXY HBGA BGA516,26X26,40 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN SILVER BALL 1 mm BOTTOM 2.55 mm 27 mm 27 mm FREESCALE SEMICONDUCTOR INC 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516 compliant 5A002 8542.31.00.01 BGA 516
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