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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: MPC8306SVMADDCA under Microprocessors

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Manufacturer Part Number: mpc8306svmaddca
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MPC8306SVMADDCA
 Freescale Semiconductor 		Check for Price Yes Yes Transferred 32 266 MHz 66.67 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B369 Not Qualified e2 3 105 °C 260 40 369 PLASTIC/EPOXY LFBGA BGA369,23X23,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm FREESCALE SEMICONDUCTOR INC BGA 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 369 compliant 3A991.A.2 8542.31.00.01
MPC8306SVMADDCA
 Rochester Electronics LLC 		Check for Price No Yes Active 32 266 MHz 66.67 MHz YES 1 V MICROPROCESSOR, RISC YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B369 COMMERCIAL e2 3 105 °C 260 40 369 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN COPPER/TIN SILVER BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm ROCHESTER ELECTRONICS LLC BGA 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 369 unknown
MPC8306SVMADDCA
 NXP Semiconductors 		Check for Price Yes Obsolete 32 266 MHz 66.67 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B369 Not Qualified e2 3 105 °C 260 40 369 PLASTIC/EPOXY LFBGA BGA369,23X23,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm NXP SEMICONDUCTORS 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 compliant 3A991.A.2 8542.31.00.01 NXP