Parametric results for: MPC8306 under Microprocessors

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Manufacturer Part Number: mpc8306
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MPC8306SVMADDCA
NXP Semiconductors
$1.0000 Yes Obsolete 32 266 MHz 66.67 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B369 Not Qualified e2 3 105 °C 260 40 369 PLASTIC/EPOXY LFBGA BGA369,23X23,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm NXP SEMICONDUCTORS 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 compliant 3A991.A.2 8542.31.00.01 NXP
MPC8306CVMADDCA
NXP Semiconductors
$15.4776 Yes Obsolete 32 266 MHz 66.67 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES OTHER S-PBGA-B369 Not Qualified e2 3 105 °C 260 40 369 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm NXP SEMICONDUCTORS 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369 compliant 3A991.A.2 8542.31.00.01 NXP
MPC8306CVMAFDCA
NXP Semiconductors
$17.0304 Yes Obsolete 32 333 MHz 66.67 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES OTHER S-PBGA-B369 e2 3 105 °C 260 40 369 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm NXP SEMICONDUCTORS 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369 compliant 3A991.A.2 8542.31.00.01 NXP
MPC8306CVMABDCA
NXP Semiconductors
$26.5500 Yes Obsolete 32 133 MHz 66.67 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES OTHER S-PBGA-B369 Not Qualified e2 3 105 °C 260 40 369 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm NXP SEMICONDUCTORS 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369 compliant 3A991.A.2 8542.31.00.01 NXP
MPC8306SCVMAFDCA
NXP Semiconductors
$48.8293 Yes Obsolete 32 333 MHz 66.67 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV INDUSTRIAL S-PBGA-B369 Not Qualified e2 3 105 °C -40 °C 260 40 369 PLASTIC/EPOXY LFBGA BGA369,23X23,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm NXP SEMICONDUCTORS 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 compliant 3A991.A.2 8542.31.00.01 NXP
MPC8306SVMABCA
NXP Semiconductors
Check for Price Active 32 133 MHz 33.33 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B369 e1 105 °C 369 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm NXP SEMICONDUCTORS 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 unknown 3A991.A.2 8542.31.00.01
MPC8306SVMACCA
Freescale Semiconductor
Check for Price Transferred 32 200 MHz 33.33 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B369 e1 105 °C 369 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm FREESCALE SEMICONDUCTOR INC LFBGA, unknown 3A991.A.2 8542.31.00.01 BGA 369
MPC8306SVMACCA
NXP Semiconductors
Check for Price Active 32 200 MHz 33.33 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B369 e1 105 °C 369 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm NXP SEMICONDUCTORS 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 unknown 3A991.A.2 8542.31.00.01
MPC8306SCVMABCA
Freescale Semiconductor
Check for Price Transferred 32 133 MHz 33.33 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B369 e1 105 °C 369 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm FREESCALE SEMICONDUCTOR INC LFBGA, unknown 3A991.A.2 8542.31.00.01 BGA 369
MPC8306SCVMADDCA
NXP Semiconductors
Check for Price Yes Obsolete 32 266 MHz 66.67 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 1.05 V 950 mV OTHER S-PBGA-B369 Not Qualified e2 3 105 °C 260 40 369 PLASTIC/EPOXY LFBGA BGA369,23X23,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver (Sn/Ag) BALL 800 µm BOTTOM 1.61 mm 19 mm 19 mm NXP SEMICONDUCTORS 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 compliant 3A991.A.2 8542.31.00.01