Findchips: Parametric Search Results for MPC7410RX400LC


Select Parts		Part Number

		MPC7410RX400LC Motorola Semiconductor Products
		MPC7410RX400LC Freescale Semiconductor
		MPC7410RX400LC Motorola Mobility LLC

		Most Relevant							Technical								Compliance		Physical									Dimensions			Other
Composite Price	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

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Obsolete

400 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

MOTOROLA INC

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

unknown

3A991.A.2

8542.31.00.01

Check for Price

Obsolete

400 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

HBGA

BGA360,19X19,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

unknown

3A991.A.2

8542.31.00.01

BGA

360

Check for Price

Obsolete

400 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

360

Compare

MPC7410RX400LC

Motorola Semiconductor Products

Check for Price

Obsolete

400 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

MOTOROLA INC

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

unknown

3A991.A.2

8542.31.00.01

MPC7410RX400LC

Freescale Semiconductor

Check for Price

Obsolete

400 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

HBGA

BGA360,19X19,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

unknown

3A991.A.2

8542.31.00.01

BGA

360

MPC7410RX400LC

Motorola Mobility LLC

Check for Price

Obsolete

400 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

360

Parametric results for: MPC7410RX400LC under Microprocessors