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MPC555LFAVR40
NXP Semiconductors
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$161.5226 | Yes | End Of Life | 32 | 40 MHz | 458752 | 26624 | MPC500 | 32 | 24 | 20 MHz | 101 | 3 | YES | 3.3 V | MICROCONTROLLER, RISC | HCMOS | ALSO REQUIRES 5V SUPPLY | YES | NO | NO | FLOATING POINT | YES | YES | 4 | 8 | 8 | YES | FLASH | 3.6 V | 3 V | MILITARY | S-PBGA-B272 | Not Qualified | e1 | 3 | 125 °C | -55 °C | 260 | 40 | 272 | PLASTIC/EPOXY | BGA | BGA272,20X20,50 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1.27 mm | BOTTOM | 2.65 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272 | compliant | 3A001.A.2.C | 8542.31.00.01 | 1997-09-16 | NXP | ||||||
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MPC555LFAVR40
onsemi
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Check for Price | Obsolete | 32 | 40 MHz | 458752 | 26624 | MPC500 | 32 | 24 | 20 MHz | 101 | 3 | YES | 3.3 V | MICROCONTROLLER, RISC | HCMOS | ALSO REQUIRES 5V SUPPLY | YES | NO | NO | FLOATING POINT | YES | YES | 4 | 8 | 8 | YES | FLASH | 3.6 V | 3 V | MILITARY | S-PBGA-B272 | Not Qualified | 125 °C | -55 °C | 272 | PLASTIC/EPOXY | BGA | BGA272,20X20,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2.65 mm | 27 mm | 27 mm | ONSEMI | 27 X 27 MM, 2.35 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272 | unknown | 3A001.A.2.C | 8542.31.00.01 | BGA | 272 | ||||||||||||
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MPC555LFAVR40
Freescale Semiconductor
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Check for Price | Yes | Yes | Transferred | 32 | 40 MHz | 458752 | 26624 | MPC500 | 32 | 24 | 20 MHz | 101 | 3 | YES | 3.3 V | MICROCONTROLLER, RISC | HCMOS | ALSO REQUIRES 5V SUPPLY | YES | NO | NO | FLOATING POINT | YES | YES | 4 | 8 | 8 | YES | FLASH | 22 mA | 3.6 V | 3 V | MILITARY | S-PBGA-B272 | Not Qualified | e1 | 3 | 125 °C | -55 °C | 260 | 40 | 272 | PLASTIC/EPOXY | BGA | BGA272,20X20,50 | SQUARE | GRID ARRAY | TIN SILVER COPPER | BALL | 1.27 mm | BOTTOM | 2.65 mm | 27 mm | 27 mm | FREESCALE SEMICONDUCTOR INC | 27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272 | compliant | 3A001.A.2 | 8542.31.00.01 | NXP | BGA | 272 |