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Parametric » Telecommunication Circuits » Cordless Telephone ICs

Parametric results for: ML2726 under Cordless Telephone ICs

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Select Parts		Part Number

		ML2726DH-T Qorvo
		ML2726DH Qorvo
		ML2726DH RF Micro Devices Inc
		ML2726DH-T RF Micro Devices Inc

			Most Relevant		Technical				Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Technology	Telecom IC Type	Number of Functions	Supply Current-Max	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Part Package Code	Pin Count	ECCN Code

Check for Price

Yes

Active

3.3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

76 µA

COMMERCIAL

S-PQFP-G32

e3

Not Qualified

60 °C

-10 °C

32

PLASTIC/EPOXY

TQFP

TQFP32,.35SQ,32

SQUARE

FLATPACK, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

QORVO INC

TQFP, TQFP32,.35SQ,32

compliant

8542.39.00.01

Check for Price

Yes

Active

3.3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

76 µA

COMMERCIAL

S-PQFP-G32

e3

Not Qualified

60 °C

-10 °C

32

PLASTIC/EPOXY

TQFP

TQFP32,.35SQ,32

SQUARE

FLATPACK, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

QORVO INC

TQFP, TQFP32,.35SQ,32

compliant

8542.39.00.01

Check for Price

Yes

Transferred

3.3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

76 µA

COMMERCIAL

S-PQFP-G32

e3

Not Qualified

60 °C

-10 °C

32

PLASTIC/EPOXY

TQFP

TQFP32,.35SQ,32

SQUARE

FLATPACK, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

RF MICRO DEVICES INC

TQFP, TQFP32,.35SQ,32

unknown

8517.70.00.00

QFP

32

5A991.G

Check for Price

Yes

Transferred

3.3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

76 µA

COMMERCIAL

S-PQFP-G32

e3

Not Qualified

60 °C

-10 °C

32

PLASTIC/EPOXY

TQFP

TQFP32,.35SQ,32

SQUARE

FLATPACK, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

RF MICRO DEVICES INC

TQFP, TQFP32,.35SQ,32

unknown

8542.39.00.01

QFP

32

Compare

Qorvo

Check for Price

Yes

Active

3.3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

76 µA

COMMERCIAL

S-PQFP-G32

e3

Not Qualified

60 °C

-10 °C

32

PLASTIC/EPOXY

TQFP

TQFP32,.35SQ,32

SQUARE

FLATPACK, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

QORVO INC

TQFP, TQFP32,.35SQ,32

compliant

8542.39.00.01

Qorvo

Check for Price

Yes

Active

3.3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

76 µA

COMMERCIAL

S-PQFP-G32

e3

Not Qualified

60 °C

-10 °C

32

PLASTIC/EPOXY

TQFP

TQFP32,.35SQ,32

SQUARE

FLATPACK, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

QORVO INC

TQFP, TQFP32,.35SQ,32

compliant

8542.39.00.01

Telecommunication Circuits

RF Micro Devices Inc

Check for Price

Yes

Transferred

3.3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

76 µA

COMMERCIAL

S-PQFP-G32

e3

Not Qualified

60 °C

-10 °C

32

PLASTIC/EPOXY

TQFP

TQFP32,.35SQ,32

SQUARE

FLATPACK, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

RF MICRO DEVICES INC

TQFP, TQFP32,.35SQ,32

unknown

8517.70.00.00

QFP

32

5A991.G

Telecommunication Circuits

RF Micro Devices Inc

Check for Price

Yes

Transferred

3.3 V

BICMOS

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT

1

76 µA

COMMERCIAL

S-PQFP-G32

e3

Not Qualified

60 °C

-10 °C

32

PLASTIC/EPOXY

TQFP

TQFP32,.35SQ,32

SQUARE

FLATPACK, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

800 µm

QUAD

7 mm

7 mm

1.2 mm

RF MICRO DEVICES INC

TQFP, TQFP32,.35SQ,32

unknown

8542.39.00.01

QFP

32