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Parametric » Telecommunication Circuits » Cellular Telephone Circuits

Parametric results for: MICRF505LYML-TR under Cellular Telephone Circuits

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Select Parts		Part Number

		MICRF505LYMLTR Microchip Technology Inc
		MICRF505LYMLTR Micrel Inc
		MICRF505LYML-TR Microchip Technology Inc

				Most Relevant		Technical			Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Technology	Telecom IC Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	HTS Code	ECCN Code	Samacsys Manufacturer

Check for Price

Yes

Yes

Transferred

2.5 V

CMOS

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

S-XQCC-N32

e4

Not Qualified

2

85 °C

-40 °C

260

40

32

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

YES

NICKEL PALLADIUM GOLD

NO LEAD

500 µm

QUAD

5 mm

5 mm

900 µm

MICREL INC

DFN

HVQCCN,

32

MLF

compliant

8542.39.00.01

Check for Price

Yes

Yes

Transferred

2.5 V

CMOS

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

S-XQCC-N32

e4

Not Qualified

2

85 °C

-40 °C

260

40

32

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

YES

NICKEL PALLADIUM GOLD

NO LEAD

500 µm

QUAD

5 mm

5 mm

900 µm

MICREL INC

DFN

HVQCCN,

32

MLF

compliant

8542.39.00.01

Check for Price

Yes

Active

2.5 V

CMOS

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

S-XQCC-N32

e4

Not Qualified

2

85 °C

-40 °C

32

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

YES

NICKEL PALLADIUM GOLD

NO LEAD

500 µm

QUAD

5 mm

5 mm

900 µm

MICROCHIP TECHNOLOGY INC

LEAD FREE, MLF-32

compliant

8542.39.00.01

EAR99

Microchip

Compare

Telecommunication Circuits

Microchip Technology Inc

Check for Price

Yes

Yes

Transferred

2.5 V

CMOS

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

S-XQCC-N32

e4

Not Qualified

2

85 °C

-40 °C

260

40

32

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

YES

NICKEL PALLADIUM GOLD

NO LEAD

500 µm

QUAD

5 mm

5 mm

900 µm

MICREL INC

DFN

HVQCCN,

32

MLF

compliant

8542.39.00.01

Telecommunication Circuits

Micrel Inc

Check for Price

Yes

Yes

Transferred

2.5 V

CMOS

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

S-XQCC-N32

e4

Not Qualified

2

85 °C

-40 °C

260

40

32

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

YES

NICKEL PALLADIUM GOLD

NO LEAD

500 µm

QUAD

5 mm

5 mm

900 µm

MICREL INC

DFN

HVQCCN,

32

MLF

compliant

8542.39.00.01

MICRF505LYML-TR

Microchip Technology Inc

Check for Price

Yes

Active

2.5 V

CMOS

RF AND BASEBAND CIRCUIT

1

INDUSTRIAL

S-XQCC-N32

e4

Not Qualified

2

85 °C

-40 °C

32

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

YES

NICKEL PALLADIUM GOLD

NO LEAD

500 µm

QUAD

5 mm

5 mm

900 µm

MICROCHIP TECHNOLOGY INC

LEAD FREE, MLF-32

compliant

8542.39.00.01

EAR99

Microchip