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Parametric » Power Circuits » Power Management Circuits

Parametric results for: MIC23060-G4YMT-TR under Power Management Circuits

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Select Parts		Part Number

		MIC23060-G4YMT-TR Microchip Technology Inc
		MIC23060-G4YMTTR Micrel Inc
		MIC23060-G4YMTTR Microchip Technology Inc

				Most Relevant						Technical			Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count	Manufacturer Package Code

Yes

Active

3.6 V

2.7 V

5.5 V

2

YES

NO

POWER SUPPLY MANAGEMENT CIRCUIT

1

AUTOMOTIVE

S-PDSO-N12

e4

Not Qualified

1

125 °C

-40 °C

12

PLASTIC/EPOXY

HVSON

SOLCC12,.1,16

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

NICKEL PALLADIUM GOLD

NO LEAD

400 µm

DUAL

2.5 mm

2.5 mm

600 µm

MICROCHIP TECHNOLOGY INC

2.50 X 2.50 MM, GREEN, MLF-12

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Yes

Transferred

3 V

2.7 V

5.5 V

2

YES

NO

POWER SUPPLY MANAGEMENT CIRCUIT

1

AUTOMOTIVE

S-XDSO-N12

e4

Not Qualified

1

125 °C

-40 °C

12

UNSPECIFIED

HVSON

SOLCC12,.1,16

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

NICKEL PALLADIUM GOLD

NO LEAD

400 µm

DUAL

2.5 mm

2.5 mm

600 µm

MICREL INC

HVSON,

compliant

EAR99

8542.39.00.01

DFN

12

MLF

Check for Price

Yes

Yes

Transferred

3 V

2.7 V

5.5 V

2

YES

NO

POWER SUPPLY MANAGEMENT CIRCUIT

1

AUTOMOTIVE

S-XDSO-N12

e4

Not Qualified

1

125 °C

-40 °C

12

UNSPECIFIED

HVSON

SOLCC12,.1,16

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

NICKEL PALLADIUM GOLD

NO LEAD

400 µm

DUAL

2.5 mm

2.5 mm

600 µm

MICREL INC

HVSON,

compliant

EAR99

8542.39.00.01

DFN

12

MLF

Compare

MIC23060-G4YMT-TR

Microchip Technology Inc

Yes

Active

3.6 V

2.7 V

5.5 V

2

YES

NO

POWER SUPPLY MANAGEMENT CIRCUIT

1

AUTOMOTIVE

S-PDSO-N12

e4

Not Qualified

1

125 °C

-40 °C

12

PLASTIC/EPOXY

HVSON

SOLCC12,.1,16

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

NICKEL PALLADIUM GOLD

NO LEAD

400 µm

DUAL

2.5 mm

2.5 mm

600 µm

MICROCHIP TECHNOLOGY INC

2.50 X 2.50 MM, GREEN, MLF-12

compliant

EAR99

8542.39.00.01

MIC23060-G4YMTTR

Micrel Inc

Check for Price

Yes

Yes

Transferred

3 V

2.7 V

5.5 V

2

YES

NO

POWER SUPPLY MANAGEMENT CIRCUIT

1

AUTOMOTIVE

S-XDSO-N12

e4

Not Qualified

1

125 °C

-40 °C

12

UNSPECIFIED

HVSON

SOLCC12,.1,16

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

NICKEL PALLADIUM GOLD

NO LEAD

400 µm

DUAL

2.5 mm

2.5 mm

600 µm

MICREL INC

HVSON,

compliant

EAR99

8542.39.00.01

DFN

12

MLF

MIC23060-G4YMTTR

Microchip Technology Inc

Check for Price

Yes

Yes

Transferred

3 V

2.7 V

5.5 V

2

YES

NO

POWER SUPPLY MANAGEMENT CIRCUIT

1

AUTOMOTIVE

S-XDSO-N12

e4

Not Qualified

1

125 °C

-40 °C

12

UNSPECIFIED

HVSON

SOLCC12,.1,16

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

NICKEL PALLADIUM GOLD

NO LEAD

400 µm

DUAL

2.5 mm

2.5 mm

600 µm

MICREL INC

HVSON,

compliant

EAR99

8542.39.00.01

DFN

12

MLF