Findchips: Parametric Search Results for MCZ33812AEKR2


Select Parts		Part Number

		MCZ33812AEKR2 Freescale Semiconductor
		MCZ33812AEKR2 NXP Semiconductors

				Most Relevant		Technical								Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Output Peak Current Limit-Nom	Interface IC Type	Built-in Protections	Number of Functions	Output Current Flow Direction	Supply Voltage-Max	Supply Voltage-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Check for Price

Yes

Transferred

14 V

3 A

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE

SINK

36 V

4.7 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

FREESCALE SEMICONDUCTOR INC

SOIC

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

unknown

EAR99

8542.39.00.01

Check for Price

Yes

Obsolete

14 V

3 A

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE

SINK

36 V

4.7 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

NXP SEMICONDUCTORS

HSSOP,

compliant

EAR99

8542.39.00.01

NXP

Compare

MCZ33812AEKR2

Freescale Semiconductor

Check for Price

Yes

Transferred

14 V

3 A

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE

SINK

36 V

4.7 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

FREESCALE SEMICONDUCTOR INC

SOIC

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

unknown

EAR99

8542.39.00.01

MCZ33812AEKR2

NXP Semiconductors

Check for Price

Yes

Obsolete

14 V

3 A

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE

SINK

36 V

4.7 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

NXP SEMICONDUCTORS

HSSOP,

compliant

EAR99

8542.39.00.01

NXP

Parametric results for: MCZ33812AEKR2 under Peripheral Drivers