Findchips: Parametric Search Results for MCIMX31

Parametric results for: MCIMX31 under Multifunction Peripherals

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		MCIMX31LCVKN5D NXP Semiconductors
		MCIMX31CJKN5D Freescale Semiconductor
		MCIMX31CJKN5D NXP Semiconductors
		MCIMX31DVMN5D Freescale Semiconductor
		MCIMX31DVKN5D NXP Semiconductors
		MCIMX31CVKN5D NXP Semiconductors
		MCIMX31CJMN4C NXP Semiconductors
		MCIMX31LDVMN5D NXP Semiconductors
		MCIMX31LDVKN5D NXP Semiconductors
		MCIMX31DVMN5D NXP Semiconductors

				Most Relevant			Technical						Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bus Compatibility	Number of I/O Lines	Surface Mount	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$19.7754

Yes

Active

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

INDUSTRIAL

S-PBGA-B457

Not Qualified

85 °C

-40 °C

260

457

PLASTIC/EPOXY

LFBGA

BGA457,26X26,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1.3 mm

14 mm

NXP SEMICONDUCTORS

14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457

compliant

5A992.C

8542.31.00.01

NXP

$22.4000

Yes

Transferred

YES

SoC

CMOS

1.65 V

1.52 V

INDUSTRIAL

S-PBGA-B457

Not Qualified

85 °C

-40 °C

260

457

PLASTIC/EPOXY

LFBGA

BGA457,26X26,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER OVER NICKEL

BALL

500 µm

BOTTOM

1.3 mm

14 mm

FREESCALE SEMICONDUCTOR INC

14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457

compliant

5A002.A

8542.31.00.01

NXP

BGA

457

$23.7307

Yes

Active

YES

SoC

CMOS

1.65 V

1.52 V

INDUSTRIAL

S-PBGA-B457

Not Qualified

85 °C

-40 °C

260

457

PLASTIC/EPOXY

LFBGA

BGA457,26X26,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1.3 mm

14 mm

NXP SEMICONDUCTORS

14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457

compliant

5A992.C

8542.31.00.01

NXP

$25.0278

Yes

Transferred

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

OTHER

S-PBGA-B473

Not Qualified

70 °C

-20 °C

260

473

PLASTIC/EPOXY

LFBGA

BGA473,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER OVER NICKEL

BALL

800 µm

BOTTOM

1.54 mm

19 mm

FREESCALE SEMICONDUCTOR INC

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473

compliant

5A002.A

8542.31.00.01

NXP

BGA

473

$26.3857

Yes

Active

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

OTHER

S-PBGA-B457

Not Qualified

70 °C

-20 °C

260

457

PLASTIC/EPOXY

LFBGA

BGA457,26X26,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1.3 mm

14 mm

NXP SEMICONDUCTORS

14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457

compliant

5A992.C

8542.31.00.01

NXP

$27.1343

Yes

Active

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

INDUSTRIAL

S-PBGA-B457

Not Qualified

85 °C

-40 °C

260

457

PLASTIC/EPOXY

LFBGA

BGA457,26X26,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1.3 mm

14 mm

NXP SEMICONDUCTORS

14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457

compliant

5A992.C

8542.31.00.01

NXP

$32.2594

Yes

Obsolete

I2C; SPI; UART; USB

MICROPROCESSOR, RISC

Not Qualified

260

Tin/Silver/Copper (Sn/Ag/Cu)

NXP SEMICONDUCTORS

compliant

5A992.C

8542.31.00.01

NXP

$33.6182

Yes

Active

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

OTHER

S-PBGA-B473

Not Qualified

70 °C

-20 °C

260

473

PLASTIC/EPOXY

LFBGA

BGA473,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.54 mm

14 mm

NXP SEMICONDUCTORS

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473

compliant

5A992.C

8542.31.00.01

NXP

$33.7480

Yes

Active

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

OTHER

S-PBGA-B457

Not Qualified

70 °C

-20 °C

260

457

PLASTIC/EPOXY

LFBGA

BGA457,26X26,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1.3 mm

14 mm

NXP SEMICONDUCTORS

14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457

compliant

5A992.C

8542.31.00.01

NXP

$34.0617

Yes

Active

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

OTHER

S-PBGA-B473

Not Qualified

70 °C

-20 °C

260

473

PLASTIC/EPOXY

LFBGA

BGA473,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.54 mm

19 mm

NXP SEMICONDUCTORS

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473

compliant

5A992.C

8542.31.00.01

NXP

1 2 3 4 5 Next

Compare

MCIMX31LCVKN5D

NXP Semiconductors

$19.7754

Yes

Active

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

INDUSTRIAL

S-PBGA-B457

Not Qualified

85 °C

-40 °C

260

457

PLASTIC/EPOXY

LFBGA

BGA457,26X26,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1.3 mm

14 mm

NXP SEMICONDUCTORS

14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457

compliant

5A992.C

8542.31.00.01

NXP

MCIMX31CJKN5D

Freescale Semiconductor

$22.4000

Yes

Transferred

YES

SoC

CMOS

1.65 V

1.52 V

INDUSTRIAL

S-PBGA-B457

Not Qualified

85 °C

-40 °C

260

457

PLASTIC/EPOXY

LFBGA

BGA457,26X26,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER OVER NICKEL

BALL

500 µm

BOTTOM

1.3 mm

14 mm

FREESCALE SEMICONDUCTOR INC

14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457

compliant

5A002.A

8542.31.00.01

NXP

BGA

457

MCIMX31CJKN5D

NXP Semiconductors

$23.7307

Yes

Active

YES

SoC

CMOS

1.65 V

1.52 V

INDUSTRIAL

S-PBGA-B457

Not Qualified

85 °C

-40 °C

260

457

PLASTIC/EPOXY

LFBGA

BGA457,26X26,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1.3 mm

14 mm

NXP SEMICONDUCTORS

14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457

compliant

5A992.C

8542.31.00.01

NXP

MCIMX31DVMN5D

Freescale Semiconductor

$25.0278

Yes

Transferred

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

OTHER

S-PBGA-B473

Not Qualified

70 °C

-20 °C

260

473

PLASTIC/EPOXY

LFBGA

BGA473,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

TIN SILVER COPPER OVER NICKEL

BALL

800 µm

BOTTOM

1.54 mm

19 mm

FREESCALE SEMICONDUCTOR INC

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473

compliant

5A002.A

8542.31.00.01

NXP

BGA

473

MCIMX31DVKN5D

NXP Semiconductors

$26.3857

Yes

Active

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

OTHER

S-PBGA-B457

Not Qualified

70 °C

-20 °C

260

457

PLASTIC/EPOXY

LFBGA

BGA457,26X26,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1.3 mm

14 mm

NXP SEMICONDUCTORS

14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457

compliant

5A992.C

8542.31.00.01

NXP

MCIMX31CVKN5D

NXP Semiconductors

$27.1343

Yes

Active

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

INDUSTRIAL

S-PBGA-B457

Not Qualified

85 °C

-40 °C

260

457

PLASTIC/EPOXY

LFBGA

BGA457,26X26,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1.3 mm

14 mm

NXP SEMICONDUCTORS

14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457

compliant

5A992.C

8542.31.00.01

NXP

MCIMX31CJMN4C

NXP Semiconductors

$32.2594

Yes

Obsolete

I2C; SPI; UART; USB

MICROPROCESSOR, RISC

Not Qualified

260

Tin/Silver/Copper (Sn/Ag/Cu)

NXP SEMICONDUCTORS

compliant

5A992.C

8542.31.00.01

NXP

MCIMX31LDVMN5D

NXP Semiconductors

$33.6182

Yes

Active

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

OTHER

S-PBGA-B473

Not Qualified

70 °C

-20 °C

260

473

PLASTIC/EPOXY

LFBGA

BGA473,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.54 mm

14 mm

NXP SEMICONDUCTORS

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473

compliant

5A992.C

8542.31.00.01

NXP

MCIMX31LDVKN5D

NXP Semiconductors

$33.7480

Yes

Active

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

OTHER

S-PBGA-B457

Not Qualified

70 °C

-20 °C

260

457

PLASTIC/EPOXY

LFBGA

BGA457,26X26,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1.3 mm

14 mm

NXP SEMICONDUCTORS

14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457

compliant

5A992.C

8542.31.00.01

NXP

MCIMX31DVMN5D

NXP Semiconductors

$34.0617

Yes

Active

YES

SoC

CMOS

UNAVAILABLE FOR IMPORT OR SALE IN US

1.65 V

1.52 V

OTHER

S-PBGA-B473

Not Qualified

70 °C

-20 °C

260

473

PLASTIC/EPOXY

LFBGA

BGA473,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.54 mm

19 mm

NXP SEMICONDUCTORS

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473

compliant

5A992.C

8542.31.00.01

NXP

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