Findchips: Parametric Search Results for MC7410VU500LE


Select Parts		Part Number

		MC7410VU500LE NXP Semiconductors
		MC7410VU500LE Freescale Semiconductor
		MC7410VU500LE Rochester Electronics LLC

				Most Relevant							Technical								Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Yes

Obsolete

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

260

360

CERAMIC, METAL-SEALED COFIRED

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, HCTE, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

Check for Price

Yes

Transferred

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

260

360

CERAMIC, METAL-SEALED COFIRED

HBGA

BGA360,19X19,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, HCTE, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

BGA

360

Check for Price

Yes

Active

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

COMMERCIAL

260

360

CERAMIC, METAL-SEALED COFIRED

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN COPPER/TIN SILVER

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

ROCHESTER ELECTRONICS LLC

25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, HCTE, CERAMIC, BGA-360

unknown

BGA

360

Compare

MC7410VU500LE

NXP Semiconductors

Check for Price

Yes

Obsolete

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

260

360

CERAMIC, METAL-SEALED COFIRED

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, HCTE, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

MC7410VU500LE

Freescale Semiconductor

Check for Price

Yes

Transferred

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

260

360

CERAMIC, METAL-SEALED COFIRED

HBGA

BGA360,19X19,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, HCTE, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

BGA

360

MC7410VU500LE

Rochester Electronics LLC

Check for Price

Yes

Active

500 MHz

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.9 V

1.7 V

S-CBGA-B360

COMMERCIAL

260

360

CERAMIC, METAL-SEALED COFIRED

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN COPPER/TIN SILVER

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

ROCHESTER ELECTRONICS LLC

25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, HCTE, CERAMIC, BGA-360

unknown

BGA

360

Parametric results for: MC7410VU500LE under Microprocessors