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Parametric results for: MBM29PL64LM10PBT under Flash Memories

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Select Parts		Part Number

		MBM29PL64LM10PBT FUJITSU Limited
		MBM29PL64LM10PBT-E1 Spansion
		MBM29PL64LM10PBT Spansion

			Most Relevant						Technical																						Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Alternate Memory Width	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Page Size	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Transferred

FUJITSU LTD

,

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

67.1089 Mbit

16

4MX16

3.3 V

100 ns

FLASH

8

1

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

OTHER

NOR TYPE

R-PBGA-B80

Not Qualified

e1

85 °C

-20 °C

80

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

SPANSION INC

PLASTIC, FBGA-80

compliant

EAR99

8542.32.00.51

BGA

80

Check for Price

No

Obsolete

67.1089 Mbit

16

64K

4MX16

3.3 V

100 ns

FLASH

8

YES

YES

YES

1

128

4000000

4.1943 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

50 µA

3.6 V

3 V

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B80

Not Qualified

e0

85 °C

-20 °C

80

PLASTIC/EPOXY

TFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

SPANSION INC

TFBGA, BGA80,8X12,32

compliant

EAR99

8542.32.00.51

BGA

80

Compare

MBM29PL64LM10PBT

FUJITSU Limited

Check for Price

Transferred

FUJITSU LTD

,

unknown

EAR99

8542.32.00.51

MBM29PL64LM10PBT-E1

Spansion

Check for Price

Yes

Obsolete

67.1089 Mbit

16

4MX16

3.3 V

100 ns

FLASH

8

1

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

OTHER

NOR TYPE

R-PBGA-B80

Not Qualified

e1

85 °C

-20 °C

80

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

SPANSION INC

PLASTIC, FBGA-80

compliant

EAR99

8542.32.00.51

BGA

80

MBM29PL64LM10PBT

Spansion

Check for Price

No

Obsolete

67.1089 Mbit

16

64K

4MX16

3.3 V

100 ns

FLASH

8

YES

YES

YES

1

128

4000000

4.1943 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

50 µA

3.6 V

3 V

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B80

Not Qualified

e0

85 °C

-20 °C

80

PLASTIC/EPOXY

TFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

SPANSION INC

TFBGA, BGA80,8X12,32

compliant

EAR99

8542.32.00.51

BGA

80