Findchips: Parametric Search Results for MBM29PDS322BE10


Select Parts		Part Number

		MBM29PDS322BE10PBT FUJITSU Semiconductor Limited
		MBM29PDS322BE10PBT FUJITSU Limited
		MBM29PDS322BE10PBT Spansion
		MBM29PDS322BE10PBT-E1 Spansion

			Most Relevant						Technical																					Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Boot Block	Command User Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Page Size	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

33.5544 Mbit

2MX16

2 V

100 ns

FLASH

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

2.2 V

1.8 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

FUJITSU SEMICONDUCTOR AMERICA INC

BGA

PLASTIC, FBGA-63

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

4K,32K

2MX16

2 V

100 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

4 words

PARALLEL

1.8 V

YES

5 µA

55 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

FUJITSU LTD

BGA

PLASTIC, FBGA-63

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

2 V

100 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

4 words

PARALLEL

1.8 V

YES

5 µA

55 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

SPANSION INC

BGA

PLASTIC, FBGA-63

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

2 V

100 ns

FLASH

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

2.2 V

1.8 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

SPANSION INC

BGA

PLASTIC, FBGA-63

compliant

EAR99

8542.32.00.51

Compare

MBM29PDS322BE10PBT

FUJITSU Semiconductor Limited

Check for Price

Transferred

33.5544 Mbit

2MX16

2 V

100 ns

FLASH

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

2.2 V

1.8 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

FUJITSU SEMICONDUCTOR AMERICA INC

BGA

PLASTIC, FBGA-63

unknown

EAR99

8542.32.00.51

MBM29PDS322BE10PBT

FUJITSU Limited

Check for Price

Transferred

33.5544 Mbit

4K,32K

2MX16

2 V

100 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

4 words

PARALLEL

1.8 V

YES

5 µA

55 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

FUJITSU LTD

BGA

PLASTIC, FBGA-63

unknown

EAR99

8542.32.00.51

MBM29PDS322BE10PBT

Spansion

Check for Price

Obsolete

33.5544 Mbit

4K,32K

2MX16

2 V

100 ns

FLASH

BOTTOM

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

4 words

PARALLEL

1.8 V

YES

5 µA

55 µA

2.2 V

1.8 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

SPANSION INC

BGA

PLASTIC, FBGA-63

compliant

EAR99

8542.32.00.51

MBM29PDS322BE10PBT-E1

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

2 V

100 ns

FLASH

BOTTOM

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

1.8 V

2.2 V

1.8 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11 mm

7 mm

SPANSION INC

BGA

PLASTIC, FBGA-63

compliant

EAR99

8542.32.00.51

Parametric results for: MBM29PDS322BE10 under Flash Memories