Findchips: Parametric Search Results for MBM29LV400BC-70PBT


Select Parts		Part Number

		MBM29LV400BC-70PBT FUJITSU Limited
		MBM29LV400BC-70PBT FUJITSU Semiconductor Limited
		MBM29LV400BC-70PBT Spansion
		MBM29LV400BC-70PBT-E1 Spansion

			Most Relevant						Technical																							Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Data Polling	Endurance	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

70 ns

FLASH

MINIMUM 100,000 PROGRAM/ERASE CYCLES

BOTTOM

YES

100000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

FUJITSU LTD

BGA

PLASTIC, FBGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

4.1943 Mbit

256KX16

3 V

70 ns

FLASH

MINIMUM 100000 PROGRAM/ERASE CYCLES

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

FUJITSU SEMICONDUCTOR AMERICA INC

BGA

PLASTIC, FBGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

70 ns

FLASH

BOTTOM

YES

100000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

BGA

TFBGA, BGA48,6X8,32

compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

4.1943 Mbit

256KX16

3 V

70 ns

FLASH

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

240

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

BGA

PLASTIC, FBGA-48

unknown

EAR99

8542.32.00.51

Compare

MBM29LV400BC-70PBT

FUJITSU Limited

Check for Price

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

70 ns

FLASH

MINIMUM 100,000 PROGRAM/ERASE CYCLES

BOTTOM

YES

100000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

FUJITSU LTD

BGA

PLASTIC, FBGA-48

unknown

EAR99

8542.32.00.51

MBM29LV400BC-70PBT

FUJITSU Semiconductor Limited

Check for Price

Transferred

4.1943 Mbit

256KX16

3 V

70 ns

FLASH

MINIMUM 100000 PROGRAM/ERASE CYCLES

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

FUJITSU SEMICONDUCTOR AMERICA INC

BGA

PLASTIC, FBGA-48

unknown

EAR99

8542.32.00.51

MBM29LV400BC-70PBT

Spansion

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

70 ns

FLASH

BOTTOM

YES

100000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

BGA

TFBGA, BGA48,6X8,32

compliant

EAR99

8542.32.00.51

MBM29LV400BC-70PBT-E1

Spansion

Check for Price

Obsolete

4.1943 Mbit

256KX16

3 V

70 ns

FLASH

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

240

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

BGA

PLASTIC, FBGA-48

unknown

EAR99

8542.32.00.51

Parametric results for: MBM29LV400BC-70PBT under Flash Memories