Register or Sign In
Parametric » Memory » Flash Memories

Parametric results for: MBM29DS163BE10 under Flash Memories

Filter Your Search

1 - 10 of 12 results

|
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
-
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
12 hits
Manufacturer Part Number: mbm29ds163be10
Select parts from the table below to compare.
 Compare
Compare
MBM29DS163BE10TR-E1
 Spansion 		Check for Price Yes Obsolete 16.7772 Mbit 16 1MX16 2 V 100 ns FLASH 8 BOTTOM 1 1000000 1.0486 M ASYNCHRONOUS PARALLEL 1.8 V 2.2 V 1.8 V CMOS INDUSTRIAL NOR TYPE R-PDSO-G48 Not Qualified e3 85 °C -40 °C 48 PLASTIC/EPOXY TSOP1-R RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC TSOP1 PLASTIC, REVERSE, TSOP1-48 48 compliant EAR99 8542.32.00.51
MBM29DS163BE10PBT
 FUJITSU Limited 		Check for Price No Transferred 16.7772 Mbit 16 8K,64K 1MX16 2 V 100 ns FLASH CONFIGURABLE AS 2M X 8 8 BOTTOM YES YES YES 1 8,31 1000000 1.0486 M ASYNCHRONOUS PARALLEL 1.8 V YES 5 µA 25 µA 2.2 V 1.8 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified e0 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 1.2 mm 8 mm 6 mm FUJITSU LTD PLASTIC, FBGA-48 unknown EAR99 8542.32.00.51
MBM29DS163BE10TN
 Spansion 		Check for Price No Obsolete 16.7772 Mbit 16 8K,64K 1MX16 2 V 100 ns FLASH 8 BOTTOM YES YES YES 1 8,31 1000000 1.0486 M ASYNCHRONOUS PARALLEL 1.8 V YES 5 µA 25 µA 2.2 V 1.8 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e0 85 °C -40 °C 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC TSOP1 PLASTIC, TSOP1-48 48 compliant EAR99 8542.32.00.51
MBM29DS163BE10TR
 FUJITSU Limited 		Check for Price No Transferred 16.7772 Mbit 16 8K,64K 1MX16 2 V 100 ns FLASH CONFIGURABLE AS 2M X 8 8 BOTTOM YES YES YES 1 8,31 1000000 1.0486 M ASYNCHRONOUS PARALLEL 1.8 V YES YES 5 µA 25 µA 2.2 V 1.8 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e0 85 °C -40 °C 48 PLASTIC/EPOXY TSOP1-R TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Tin/Lead (Sn/Pb) GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm FUJITSU LTD PLASTIC, REVERSE, TSOP1-48 unknown EAR99 8542.32.00.51
MBM29DS163BE10PBT
 FUJITSU Semiconductor Limited 		Check for Price No Transferred 16.7772 Mbit 16 8K,64K 1MX16 2 V 100 ns FLASH CONFIGURABLE AS 2M X 8 8 BOTTOM YES YES YES 1 8,31 1000000 1.0486 M ASYNCHRONOUS PARALLEL 1.8 V YES 5 µA 25 µA 2.2 V 1.8 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified e0 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 1.2 mm 8 mm 6 mm FUJITSU LTD BGA TFBGA, BGA48,6X8,32 48 unknown EAR99 8542.32.00.51
MBM29DS163BE10PBT-E1
 Spansion 		Check for Price Yes Obsolete 16.7772 Mbit 16 1MX16 2 V 100 ns FLASH 8 BOTTOM 1 1000000 1.0486 M ASYNCHRONOUS PARALLEL 1.8 V 2.2 V 1.8 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B48 Not Qualified e1 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC BGA PLASTIC, FBGA-48 48 compliant EAR99 8542.32.00.51
MBM29DS163BE10TR
 Spansion 		Check for Price No Obsolete 16.7772 Mbit 16 8K,64K 1MX16 2 V 100 ns FLASH 8 BOTTOM YES YES YES 1 8,31 1000000 1.0486 M ASYNCHRONOUS PARALLEL 1.8 V YES YES 5 µA 25 µA 2.2 V 1.8 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e0 85 °C -40 °C 48 PLASTIC/EPOXY TSOP1-R TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC TSOP1 PLASTIC, REVERSE, TSOP1-48 48 compliant EAR99 8542.32.00.51
MBM29DS163BE10TR
 FUJITSU Semiconductor Limited 		Check for Price No Transferred 16.7772 Mbit 16 8K,64K 1MX16 2 V 100 ns FLASH CONFIGURABLE AS 2M X 8 8 BOTTOM YES YES YES 1 8,31 1000000 1.0486 M ASYNCHRONOUS PARALLEL 1.8 V YES YES 5 µA 25 µA 2.2 V 1.8 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e0 85 °C -40 °C 48 PLASTIC/EPOXY TSOP1-R TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Tin/Lead (Sn/Pb) GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm FUJITSU LTD TSOP1 TSOP1-R, TSSOP48,.8,20 48 unknown EAR99 8542.32.00.51
MBM29DS163BE10TN
 FUJITSU Semiconductor Limited 		Check for Price No Transferred 16.7772 Mbit 16 8K,64K 1MX16 2 V 100 ns FLASH CONFIGURABLE AS 2M X 8 8 BOTTOM YES YES YES 1 8,31 1000000 1.0486 M ASYNCHRONOUS PARALLEL 1.8 V YES 5 µA 25 µA 2.2 V 1.8 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e0 85 °C -40 °C 48 PLASTIC/EPOXY TSOP1 TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Tin/Lead (Sn/Pb) GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm FUJITSU LTD TSOP1 TSOP1, TSSOP48,.8,20 48 unknown EAR99 8542.32.00.51
MBM29DS163BE10PBT
 Spansion 		Check for Price No Obsolete 16.7772 Mbit 16 8K,64K 1MX16 2 V 100 ns FLASH 8 BOTTOM YES YES YES 1 8,31 1000000 1.0486 M ASYNCHRONOUS PARALLEL 1.8 V YES 5 µA 25 µA 2.2 V 1.8 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified e0 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC BGA PLASTIC, FBGA-48 48 compliant EAR99 8542.32.00.51
12Next