Parametric results for: MBM29DL321BD12PBT under Flash Memories

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Manufacturer Part Number: mbm29dl321bd12pbt
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MBM29DL321BD12PBT
FUJITSU Semiconductor Limited
Check for Price Transferred 33.5544 Mbit 16 2MX16 3 V 120 ns FLASH 8 BOTTOM 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B57 Not Qualified 85 °C -40 °C 57 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 13.95 mm 7.95 mm FUJITSU SEMICONDUCTOR AMERICA INC TFBGA, unknown EAR99 8542.32.00.51
MBM29DL321BD12PBT-E1
Spansion
Check for Price Yes Obsolete 33.5544 Mbit 16 2MX16 3 V 120 ns FLASH 8 BOTTOM 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B57 Not Qualified e1 85 °C -40 °C 57 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 13.95 mm 7.95 mm SPANSION INC TFBGA, compliant EAR99 8542.32.00.51 BGA 57
MBM29DL321BD-12PBT
FUJITSU Semiconductor Limited
Check for Price No Obsolete 33.5544 Mbit 8 8K,64K 4MX8 3 V 120 ns FLASH CONFIGURABLE AS 2M X 16 8 BOTTOM YES YES YES 1 8,63 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 53 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B57 Not Qualified e0 85 °C -40 °C 57 PLASTIC/EPOXY TFBGA BGA56,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 1.2 mm 13.95 mm 7.95 mm FUJITSU LTD TFBGA, BGA56,8X12,32 unknown EAR99 8542.32.00.51 BGA 57
MBM29DL321BD-12PBT
FUJITSU Limited
Check for Price No Obsolete 33.5544 Mbit 8 8K,64K 4MX8 3 V 120 ns FLASH CONFIGURABLE AS 2M X 16 8 BOTTOM YES YES YES 1 8,63 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 53 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B57 Not Qualified e0 85 °C -40 °C 57 PLASTIC/EPOXY TFBGA BGA56,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 1.2 mm 13.95 mm 7.95 mm FUJITSU LTD TFBGA, BGA56,8X12,32 unknown EAR99 8542.32.00.51
MBM29DL321BD12PBT
FUJITSU Limited
Check for Price Transferred 33.5544 Mbit 16 2MX16 3 V 120 ns FLASH 8 BOTTOM 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B57 Not Qualified 85 °C -40 °C 57 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 13.95 mm 7.95 mm FUJITSU SEMICONDUCTOR AMERICA INC TFBGA, unknown EAR99 8542.32.00.51 BGA 57
MBM29DL321BD12PBT
Spansion
Check for Price No Obsolete 33.5544 Mbit 16 2MX16 3 V 120 ns FLASH 8 BOTTOM 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B57 Not Qualified e0 85 °C -40 °C 57 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 13.95 mm 7.95 mm SPANSION INC TFBGA, compliant EAR99 8542.32.00.51 BGA 57