Parametric results for: MB87017B under Telecom Signaling Circuits
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MB87017BPF
FUJITSU Semiconductor Limited
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Check for Price | Obsolete | 5 V | DTMF SIGNALING CIRCUIT | 1 | COMMERCIAL | R-PDSO-G24 | Not Qualified | 70 °C | 24 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.6 mm | 15.24 mm | 2.8 mm | FUJITSU SEMICONDUCTOR AMERICA INC | SOP, | unknown | 8542.39.00.01 | |||||||||
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MB87017BP
FUJITSU Semiconductor Limited
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Check for Price | Obsolete | 5 V | DTMF SIGNALING CIRCUIT | 1 | COMMERCIAL | R-PDIP-T18 | Not Qualified | 70 °C | 18 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 22.05 mm | 5 mm | FUJITSU SEMICONDUCTOR AMERICA INC | DIP, | unknown | 8542.39.00.01 | |||||||||
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MB87017BP
FUJITSU Limited
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Check for Price | No | Obsolete | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | COMMERCIAL | R-PDIP-T18 | e0 | Not Qualified | 70 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | FUJITSU LTD | DIP, DIP18,.3 | unknown | 8542.39.00.01 | DIP | 18 | |||||
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MB87017BPF
FUJITSU Limited
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Check for Price | No | Obsolete | 5 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | COMMERCIAL | R-PDSO-G24 | e0 | Not Qualified | 70 °C | 24 | PLASTIC/EPOXY | SOP | SOP24,.4 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | FUJITSU LTD | SOP, SOP24,.4 | unknown | 8542.39.00.01 | SOIC | 24 |