Parametric results for: MAX9039BEBT+ under Comparators
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MAX9039BEBT+T
Maxim Integrated Products
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$52.0935 | Yes | Yes | Transferred | 9 mV | 25 nA | 450 ns | 1 | COMPARATOR | 5 V | PUSH-PULL | 6 V | INDUSTRIAL | R-PBGA-B6 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VFBGA | BGA6,2X3,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 670 µm | 1.05 mm | 1.57 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | VFBGA, BGA6,2X3,20 | 6 | compliant | EAR99 | 8542.39.00.01 | |||||||||
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MAX9039BEBT+T10
Maxim Integrated Products
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Check for Price | Yes | Transferred | ANALOG CIRCUIT | e1 | 1 | 260 | 30 | TIN SILVER COPPER | MAXIM INTEGRATED PRODUCTS INC | VFBGA, | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||||
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MAX9039BEBT
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 9 mV | 100 µA | 450 ns | 1 | COMPARATOR | 5 V | BIPOLAR | 25 nA | 6 V | INDUSTRIAL | R-PBGA-B6 | Not Qualified | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | FBGA | BGA6,2X3,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 500 µm | BOTTOM | MAXIM INTEGRATED PRODUCTS INC | SOT-23 | 5 | not_compliant | EAR99 | 8542.39.00.01 | |||||||||||||||||
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MAX9039BEBT-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 9 mV | 25 nA | 100 µA | 450 ns | 1 | COMPARATOR | 5 V | 25 nA | PUSH-PULL | 6 V | INDUSTRIAL | R-PBGA-B6 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | VFBGA | BGA6,2X3,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 500 µm | BOTTOM | 670 µm | 1.05 mm | 1.57 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 3 X 2, UCSP-6 | 6 | not_compliant | EAR99 | 8542.39.00.01 | |||||||||
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MAX9039BEBT+T
Analog Devices Inc
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Check for Price | Yes | Active | 9 mV | 25 nA | 450 ns | 1 | COMPARATOR | 5 V | PUSH-PULL | 6 V | INDUSTRIAL | R-PBGA-B6 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VFBGA | BGA6,2X3,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 670 µm | 1.05 mm | 1.57 mm | 6-WLCSP-N/A | 6 | 6-WLCSP-N/A | 2002-04-01 | Analog Devices | ||||||||||||
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MAX9039BEBT+
Analog Devices Inc
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Check for Price | Yes | Active | 9 mV | 25 nA | 100 µA | 450 ns | 1 | COMPARATOR | 5 V | BIPOLAR | 25 nA | PUSH-PULL | 6 V | INDUSTRIAL | R-PBGA-B6 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VFBGA | BGA6,2X3,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 670 µm | 1.05 mm | 1.57 mm | 6-WLCSP-N/A | 6 | 6-WLCSP-N/A | 2002-04-01 | Analog Devices | |||||||||
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MAX9039BEBT+
Maxim Integrated Products
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Check for Price | Yes | Transferred | 9 mV | 25 nA | 100 µA | 450 ns | 1 | COMPARATOR | 5 V | BIPOLAR | 25 nA | PUSH-PULL | 6 V | INDUSTRIAL | R-PBGA-B6 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VFBGA | BGA6,2X3,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 670 µm | 1.05 mm | 1.57 mm | MAXIM INTEGRATED PRODUCTS INC | VFBGA, BGA6,2X3,20 | compliant | EAR99 | 8542.39.00.01 |