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MAX78615+PPM/A03
Maxim Integrated Products
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Check for Price | Yes | Transferred | YES | 3.3 V | MICROPROCESSOR CIRCUIT | CMOS | 3.6 V | 3 V | INDUSTRIAL | S-XQCC-N24 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 800 µm | 4 mm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | TQFN-24 | compliant | 8542.31.00.01 | ||
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MAX78615+PPM/A03T
Silergy Corporation
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Check for Price | Yes | Contact Manufacturer | YES | 3.3 V | MICROPROCESSOR CIRCUIT | CMOS | 3.6 V | 3 V | INDUSTRIAL | S-XQCC-N24 | e3 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 800 µm | 4 mm | 4 mm | SILERGY CORP | TQFN-24 | compliant | 8542.31.00.01 | ||
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MAX78615+PPM/A03T
Maxim Integrated Products
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Check for Price | Yes | Transferred | YES | 3.3 V | MICROPROCESSOR CIRCUIT | CMOS | 3.6 V | 3 V | INDUSTRIAL | S-XQCC-N24 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 800 µm | 4 mm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | TQFN-24 | compliant | 8542.31.00.01 | ||
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MAX78615+PPM/A03
Silergy Corporation
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Check for Price | Yes | Contact Manufacturer | YES | 3.3 V | MICROPROCESSOR CIRCUIT | CMOS | 3.6 V | 3 V | INDUSTRIAL | S-XQCC-N24 | e3 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 800 µm | 4 mm | 4 mm | SILERGY CORP | TQFN-24 | compliant | 8542.31.00.01 |