Findchips: Parametric Search Results for MAX77650CEWV+


Select Parts		Part Number

		MAX77650CEWV+T Maxim Integrated Products
		MAX77650CEWV+ Analog Devices Inc
		MAX77650CEWV+T Analog Devices Inc
		MAX77650CEWV+ Maxim Integrated Products

			Most Relevant								Technical			Compliance		Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Supply Current-Max (Isup)	Threshold Voltage-Nom	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro	Part Package Code	Pin Count	Manufacturer Package Code	Samacsys Manufacturer

Check for Price

Yes

Transferred

3.7 V

2.7 V

5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

R-PBGA-B30

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

2.148 mm

2.748 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

WLP-30

compliant

EAR99

8542.39.00.01

2017-07-12

Check for Price

Yes

Active

3.7 V

2.7 V

5.5 V

60 µA

+2.85V

YES

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

R-PBGA-B30

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA30,5X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

2.148 mm

2.748 mm

690 µm

2016-07-22

30-WLCSP-N/A

Analog Devices

Check for Price

Yes

Active

3.7 V

2.7 V

5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

R-PBGA-B30

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

2.148 mm

2.748 mm

690 µm

ANALOG DEVICES INC

WLP-30

compliant

2016-07-22

30-WLCSP-N/A

Analog Devices

Check for Price

Yes

Transferred

3.7 V

2.7 V

5.5 V

60 µA

+2.85V

YES

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

R-PBGA-B30

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA30,5X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

2.148 mm

2.748 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

VFBGA, BGA30,5X6,16

compliant

EAR99

8542.39.00.01

Compare

MAX77650CEWV+T

Maxim Integrated Products

Check for Price

Yes

Transferred

3.7 V

2.7 V

5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

R-PBGA-B30

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

2.148 mm

2.748 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

WLP-30

compliant

EAR99

8542.39.00.01

2017-07-12

MAX77650CEWV+

Analog Devices Inc

Check for Price

Yes

Active

3.7 V

2.7 V

5.5 V

60 µA

+2.85V

YES

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

R-PBGA-B30

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA30,5X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

2.148 mm

2.748 mm

690 µm

2016-07-22

30-WLCSP-N/A

Analog Devices

MAX77650CEWV+T

Analog Devices Inc

Check for Price

Yes

Active

3.7 V

2.7 V

5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

R-PBGA-B30

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

2.148 mm

2.748 mm

690 µm

ANALOG DEVICES INC

WLP-30

compliant

2016-07-22

30-WLCSP-N/A

Analog Devices

MAX77650CEWV+

Maxim Integrated Products

Check for Price

Yes

Transferred

3.7 V

2.7 V

5.5 V

60 µA

+2.85V

YES

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

R-PBGA-B30

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA30,5X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

2.148 mm

2.748 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

VFBGA, BGA30,5X6,16

compliant

EAR99

8542.39.00.01

Parametric results for: MAX77650CEWV+ under Power Management Circuits