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MAX5883EGM+TD
Analog Devices Inc
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Check for Price Buy | Yes | Active | 3.3 V | 1.1 V | -500 mV | 12 | YES | D/A CONVERTER | BINARY | PARALLEL, WORD | 1 | 11 ns | CMOS | INDUSTRIAL | S-XQCC-N48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 1 mm | 7 mm | ANALOG DEVICES INC | 48-LFCSP-7X7X0.85 | 7 X 7 MM, 0.9 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-48 | 48 | 48-LFCSP-7X7X0.85 | compliant | 2003-05-14 | Analog Devices | |||||
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MAX5883EGM-TD
Maxim Integrated Products
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Check for Price Buy | No | Obsolete | 3.3 V | 1.1 V | -500 mV | 12 | YES | D/A CONVERTER | BINARY | PARALLEL, WORD | 1 | 11 ns | CMOS | INDUSTRIAL | S-XQCC-N48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 245 | NOT SPECIFIED | 48 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 7 mm | 1 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 7 X 7 MM, 0.9 MM HEIGHT, MO-220, QFN-48 | 48 | not_compliant | 8542.39.00.01 | |||||||
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MAX5883EGM+TD
Maxim Integrated Products
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Check for Price Buy | Yes | Yes | Transferred | 3.3 V | 1.1 V | -500 mV | 12 | YES | D/A CONVERTER | BINARY | PARALLEL, WORD | 1 | 11 ns | CMOS | INDUSTRIAL | S-XQCC-N48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 7 mm | 1 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 7 X 7 MM, 0.9 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-48 | 48 | compliant | 8542.39.00.01 | EAR99 |