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MAX5582EUP+
Analog Devices Inc
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$17.8236 | Yes | Active | 3 V | 5.25 V | 0.0977 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 2.5 µs | 4 mA | BICMOS | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | HTSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 4.4 mm | 1.1 mm | 6.5 mm | ANALOG DEVICES INC | 20-TSSOP_4.4_EP-4.4_MM | 4.40 MM, MO-153, TSSOP-20 | 20 | 20-TSSOP_4.4_EP-4.4_MM | compliant | 2004-02-17 | Analog Devices | |||||
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MAX5582EUP-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 5 V | 5.25 V | 0.0977 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 2.5 µs | 4 mA | BICMOS | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | HTSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 1.1 mm | 6.5 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | 4.40 MM, MO-153ACT, TSSOP-20 | 20 | not_compliant | 8542.39.00.01 | ||||||||
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MAX5582EUP+
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3 V | 5.25 V | 0.0977 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 2.5 µs | 4 mA | BICMOS | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | HTSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 4.4 mm | 1.1 mm | 6.5 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | 4.40 MM, MO-153, TSSOP-20 | 20 | compliant | 8542.39.00.01 | EAR99 | |||||
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MAX5582EUP+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3 V | 5.25 V | 0.0977 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 2.5 µs | 4 mA | BICMOS | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | HTSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 4.4 mm | 1.1 mm | 6.5 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | 4.40 MM, MO-153, TSSOP-20 | 20 | compliant | 8542.39.00.01 | EAR99 | |||||
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MAX5582EUP+T
Analog Devices Inc
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Check for Price | Yes | Active | 3 V | 5.25 V | 0.0977 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 2.5 µs | 4 mA | BICMOS | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | HTSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 4.4 mm | 1.1 mm | 6.5 mm | ANALOG DEVICES INC | 20-TSSOP_4.4_EP-4.4_MM | 4.40 MM, MO-153, TSSOP-20 | 20 | 20-TSSOP_4.4_EP-4.4_MM | compliant | 2004-02-17 | Analog Devices | |||||
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MAX5582EUP
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 5 V | 5.25 V | 0.0977 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 2.5 µs | 4 mA | BICMOS | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 20 | PLASTIC/EPOXY | HTSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 1.1 mm | 6.5 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | 4.40 MM, MO-153ACT, TSSOP-20 | 20 | not_compliant | 8542.39.00.01 | EAR99 |