Parametric results for: MAX5304CUA+ under Digital to Analog Converters

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Manufacturer Part Number: max5304cua
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MAX5304CUA-T
Maxim Integrated Products
MAX5304CUA+
Analog Devices Inc
MAX5304CUA+T
Maxim Integrated Products
MAX5304CUA
Maxim Integrated Products
MAX5304CUA+
Maxim Integrated Products
MAX5304CUA+T
Analog Devices Inc
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Rohs Code
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Supply Voltage-Nom Linearity Error-Max (EL)
Number of Bits Surface Mount
Converter Type
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Number of Functions Settling Time-Nom (tstl)
Supply Current-Max
Technology Temperature Grade
JESD-30 Code
Qualification Status
JESD-609 Code
Moisture Sensitivity Level
Operating Temperature-Max
Peak Reflow Temperature (Cel)
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
Package Body Material
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Package Equivalence Code
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Terminal Form
Terminal Pitch
Terminal Position
Width
Seated Height-Max
Length
Ihs Manufacturer
Part Package Code
Package Description
Pin Count
Reach Compliance Code
HTS Code
Manufacturer Package Code
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Samacsys Manufacturer
ECCN Code
No No Obsolete 5 V 0.3906 % 10 YES D/A CONVERTER OFFSET BINARY SERIAL 1 10 µs COMMERCIAL S-PDSO-G8 Not Qualified e0 1 70 °C 245 8 PLASTIC/EPOXY TSSOP SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN LEAD GULL WING 650 µm DUAL 3 mm 1.1 mm 3 mm MAXIM INTEGRATED PRODUCTS INC SOIC EXPOSED PAD, MICRO MAX PACKAGE-8 8 not_compliant 8542.39.00.01
Yes Active 5 V 0.3906 % 10 YES D/A CONVERTER OFFSET BINARY SERIAL 1 10 µs 400 µA CMOS COMMERCIAL S-PDSO-G8 Not Qualified e3 1 70 °C 260 30 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Matte Tin (Sn) GULL WING 650 µm DUAL 3 mm 1.1 mm 3 mm ANALOG DEVICES INC 8-MINI_SO-N/A EXPOSED PAD, MICRO MAX PACKAGE-8 8 compliant 8-MINI_SO-N/A 1999-10-01 Analog Devices
Yes Yes Transferred 5 V 0.3906 % 10 YES D/A CONVERTER OFFSET BINARY SERIAL 1 10 µs COMMERCIAL S-PDSO-G8 Not Qualified e3 1 70 °C 260 30 8 PLASTIC/EPOXY TSSOP SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH MATTE TIN GULL WING 650 µm DUAL 3 mm 1.1 mm 3 mm MAXIM INTEGRATED PRODUCTS INC SOIC EXPOSED PAD, MICRO MAX PACKAGE-8 8 compliant 8542.39.00.01 EAR99
No No Obsolete 5 V 0.3906 % 10 YES D/A CONVERTER OFFSET BINARY SERIAL 1 10 µs 400 µA CMOS COMMERCIAL S-PDSO-G8 Not Qualified e0 1 70 °C 245 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN LEAD GULL WING 650 µm DUAL 3 mm 1.1 mm 3 mm MAXIM INTEGRATED PRODUCTS INC SOIC TSSOP, TSSOP8,.19 8 not_compliant 8542.39.00.01 EAR99
Yes Yes Transferred 5 V 0.3906 % 10 YES D/A CONVERTER OFFSET BINARY SERIAL 1 10 µs 400 µA CMOS COMMERCIAL S-PDSO-G8 Not Qualified e3 1 70 °C 260 30 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH MATTE TIN GULL WING 650 µm DUAL 3 mm 1.1 mm 3 mm MAXIM INTEGRATED PRODUCTS INC SOIC EXPOSED PAD, MICRO MAX PACKAGE-8 8 compliant 8542.39.00.01 EAR99
Yes Active 5 V 0.3906 % 10 YES D/A CONVERTER OFFSET BINARY SERIAL 1 10 µs COMMERCIAL S-PDSO-G8 Not Qualified e3 1 70 °C 260 30 8 PLASTIC/EPOXY TSSOP SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Matte Tin (Sn) GULL WING 650 µm DUAL 3 mm 1.1 mm 3 mm ANALOG DEVICES INC 8-MINI_SO-N/A EXPOSED PAD, MICRO MAX PACKAGE-8 8 compliant 8-MINI_SO-N/A 1999-10-01 Analog Devices
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MAX5304CUA-T
Maxim Integrated Products
Check for Price No No Obsolete 5 V 0.3906 % 10 YES D/A CONVERTER OFFSET BINARY SERIAL 1 10 µs COMMERCIAL S-PDSO-G8 Not Qualified e0 1 70 °C 245 8 PLASTIC/EPOXY TSSOP SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN LEAD GULL WING 650 µm DUAL 3 mm 1.1 mm 3 mm MAXIM INTEGRATED PRODUCTS INC SOIC EXPOSED PAD, MICRO MAX PACKAGE-8 8 not_compliant 8542.39.00.01
MAX5304CUA+
Analog Devices Inc
Check for Price Yes Active 5 V 0.3906 % 10 YES D/A CONVERTER OFFSET BINARY SERIAL 1 10 µs 400 µA CMOS COMMERCIAL S-PDSO-G8 Not Qualified e3 1 70 °C 260 30 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Matte Tin (Sn) GULL WING 650 µm DUAL 3 mm 1.1 mm 3 mm ANALOG DEVICES INC 8-MINI_SO-N/A EXPOSED PAD, MICRO MAX PACKAGE-8 8 compliant 8-MINI_SO-N/A 1999-10-01 Analog Devices
MAX5304CUA+T
Maxim Integrated Products
Check for Price Yes Yes Transferred 5 V 0.3906 % 10 YES D/A CONVERTER OFFSET BINARY SERIAL 1 10 µs COMMERCIAL S-PDSO-G8 Not Qualified e3 1 70 °C 260 30 8 PLASTIC/EPOXY TSSOP SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH MATTE TIN GULL WING 650 µm DUAL 3 mm 1.1 mm 3 mm MAXIM INTEGRATED PRODUCTS INC SOIC EXPOSED PAD, MICRO MAX PACKAGE-8 8 compliant 8542.39.00.01 EAR99
MAX5304CUA
Maxim Integrated Products
Check for Price No No Obsolete 5 V 0.3906 % 10 YES D/A CONVERTER OFFSET BINARY SERIAL 1 10 µs 400 µA CMOS COMMERCIAL S-PDSO-G8 Not Qualified e0 1 70 °C 245 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN LEAD GULL WING 650 µm DUAL 3 mm 1.1 mm 3 mm MAXIM INTEGRATED PRODUCTS INC SOIC TSSOP, TSSOP8,.19 8 not_compliant 8542.39.00.01 EAR99
MAX5304CUA+
Maxim Integrated Products
Check for Price Yes Yes Transferred 5 V 0.3906 % 10 YES D/A CONVERTER OFFSET BINARY SERIAL 1 10 µs 400 µA CMOS COMMERCIAL S-PDSO-G8 Not Qualified e3 1 70 °C 260 30 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH MATTE TIN GULL WING 650 µm DUAL 3 mm 1.1 mm 3 mm MAXIM INTEGRATED PRODUCTS INC SOIC EXPOSED PAD, MICRO MAX PACKAGE-8 8 compliant 8542.39.00.01 EAR99
MAX5304CUA+T
Analog Devices Inc
Check for Price Yes Active 5 V 0.3906 % 10 YES D/A CONVERTER OFFSET BINARY SERIAL 1 10 µs COMMERCIAL S-PDSO-G8 Not Qualified e3 1 70 °C 260 30 8 PLASTIC/EPOXY TSSOP SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Matte Tin (Sn) GULL WING 650 µm DUAL 3 mm 1.1 mm 3 mm ANALOG DEVICES INC 8-MINI_SO-N/A EXPOSED PAD, MICRO MAX PACKAGE-8 8 compliant 8-MINI_SO-N/A 1999-10-01 Analog Devices