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Select Parts | Part Number |
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MAX5304CUA-T
Maxim Integrated Products
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MAX5304CUA+
Analog Devices Inc
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MAX5304CUA+T
Maxim Integrated Products
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MAX5304CUA
Maxim Integrated Products
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MAX5304CUA+
Maxim Integrated Products
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MAX5304CUA+T
Analog Devices Inc
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Supply Voltage-Nom |
Linearity Error-Max (EL)
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Number of Bits |
Surface Mount
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Converter Type
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Input Bit Code
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Input Format
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Number of Functions |
Settling Time-Nom (tstl)
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Supply Current-Max
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Technology |
Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Width
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Seated Height-Max
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Length
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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HTS Code
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Manufacturer Package Code
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Date Of Intro
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Samacsys Manufacturer
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ECCN Code
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No | No | Obsolete | 5 V | 0.3906 % | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 10 µs | COMMERCIAL | S-PDSO-G8 | Not Qualified | e0 | 1 | 70 °C | 245 | 8 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | EXPOSED PAD, MICRO MAX PACKAGE-8 | 8 | not_compliant | 8542.39.00.01 | |||||||||
Yes | Active | 5 V | 0.3906 % | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 10 µs | 400 µA | CMOS | COMMERCIAL | S-PDSO-G8 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | 8-MINI_SO-N/A | EXPOSED PAD, MICRO MAX PACKAGE-8 | 8 | compliant | 8-MINI_SO-N/A | 1999-10-01 | Analog Devices | ||||
Yes | Yes | Transferred | 5 V | 0.3906 % | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 10 µs | COMMERCIAL | S-PDSO-G8 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | EXPOSED PAD, MICRO MAX PACKAGE-8 | 8 | compliant | 8542.39.00.01 | EAR99 | |||||||
No | No | Obsolete | 5 V | 0.3906 % | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 10 µs | 400 µA | CMOS | COMMERCIAL | S-PDSO-G8 | Not Qualified | e0 | 1 | 70 °C | 245 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | TSSOP, TSSOP8,.19 | 8 | not_compliant | 8542.39.00.01 | EAR99 | |||||
Yes | Yes | Transferred | 5 V | 0.3906 % | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 10 µs | 400 µA | CMOS | COMMERCIAL | S-PDSO-G8 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | EXPOSED PAD, MICRO MAX PACKAGE-8 | 8 | compliant | 8542.39.00.01 | EAR99 | ||||
Yes | Active | 5 V | 0.3906 % | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 10 µs | COMMERCIAL | S-PDSO-G8 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | 8-MINI_SO-N/A | EXPOSED PAD, MICRO MAX PACKAGE-8 | 8 | compliant | 8-MINI_SO-N/A | 1999-10-01 | Analog Devices |
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MAX5304CUA-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 5 V | 0.3906 % | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 10 µs | COMMERCIAL | S-PDSO-G8 | Not Qualified | e0 | 1 | 70 °C | 245 | 8 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | EXPOSED PAD, MICRO MAX PACKAGE-8 | 8 | not_compliant | 8542.39.00.01 | ||||||||||
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MAX5304CUA+
Analog Devices Inc
|
Check for Price | Yes | Active | 5 V | 0.3906 % | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 10 µs | 400 µA | CMOS | COMMERCIAL | S-PDSO-G8 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | 8-MINI_SO-N/A | EXPOSED PAD, MICRO MAX PACKAGE-8 | 8 | compliant | 8-MINI_SO-N/A | 1999-10-01 | Analog Devices | |||||
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MAX5304CUA+T
Maxim Integrated Products
|
Check for Price | Yes | Yes | Transferred | 5 V | 0.3906 % | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 10 µs | COMMERCIAL | S-PDSO-G8 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | EXPOSED PAD, MICRO MAX PACKAGE-8 | 8 | compliant | 8542.39.00.01 | EAR99 | ||||||||
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MAX5304CUA
Maxim Integrated Products
|
Check for Price | No | No | Obsolete | 5 V | 0.3906 % | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 10 µs | 400 µA | CMOS | COMMERCIAL | S-PDSO-G8 | Not Qualified | e0 | 1 | 70 °C | 245 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | TSSOP, TSSOP8,.19 | 8 | not_compliant | 8542.39.00.01 | EAR99 | ||||||
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MAX5304CUA+
Maxim Integrated Products
|
Check for Price | Yes | Yes | Transferred | 5 V | 0.3906 % | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 10 µs | 400 µA | CMOS | COMMERCIAL | S-PDSO-G8 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | EXPOSED PAD, MICRO MAX PACKAGE-8 | 8 | compliant | 8542.39.00.01 | EAR99 | |||||
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MAX5304CUA+T
Analog Devices Inc
|
Check for Price | Yes | Active | 5 V | 0.3906 % | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 10 µs | COMMERCIAL | S-PDSO-G8 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | 8-MINI_SO-N/A | EXPOSED PAD, MICRO MAX PACKAGE-8 | 8 | compliant | 8-MINI_SO-N/A | 1999-10-01 | Analog Devices |