Findchips: Parametric Search Results for MAX4947

Parametric results for: MAX4947 under Multiplexers or Switches

Select parts from the table below to compare.

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Select Parts		Part Number

		MAX4947ETG+ Maxim Integrated Products
		MAX4947EBA+ Maxim Integrated Products
		MAX4947ERA+ Maxim Integrated Products
		MAX4947ETG+T Maxim Integrated Products
		MAX4947ETG+T Analog Devices Inc
		MAX4947ERA+T Maxim Integrated Products
		MAX4947ETG/GG8 Analog Devices Inc
		MAX4947EBA+ Rochester Electronics LLC
		MAX4947EBA+T Maxim Integrated Products
		MAX4947ETG/GG8 Maxim Integrated Products

				Most Relevant						Technical												Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Surface Mount	On-state Resistance-Max (Ron)	On-state Resistance Match-Nom	Switch-on Time-Max	Switch-off Time-Max	Analog IC - Other Type	Technology	Input Voltage-Max	Number of Channels	Number of Functions	Off-state Isolation-Nom	Output	Supply Current-Max (Isup)	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Switching	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Manufacturer Package Code	Date Of Intro	Samacsys Manufacturer

$4.7709

Yes

Transferred

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XQCC-N24

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

500 µm

QUAD

4 mm

800 µm

4 mm

MAXIM INTEGRATED PRODUCTS INC

QFN

4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGD-1, TQFN-24

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Obsolete

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XBGA-B25

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

VFBGA

BGA25,5X5,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.54 mm

670 µm

2.54 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA25,5X5,20

compliant

8542.39.00.01

Check for Price

Yes

Obsolete

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

5.5 V

1.8 V

INDUSTRIAL

S-PBGA-B25

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.56 mm

690 µm

2.56 mm

MAXIM INTEGRATED PRODUCTS INC

VFBGA,

compliant

8542.39.00.01

Check for Price

Yes

Transferred

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XQCC-N24

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

500 µm

QUAD

4 mm

800 µm

4 mm

MAXIM INTEGRATED PRODUCTS INC

QFN

HVQCCN, LCC24,.16SQ,20

compliant

8542.39.00.01

Check for Price

Yes

Active

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XQCC-N24

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

500 µm

QUAD

4 mm

800 µm

4 mm

24-LFCSP-4X4X0.75

2006-11-16

Analog Devices

Check for Price

Yes

Obsolete

DPDT

260

TIN SILVER COPPER

MAXIM INTEGRATED PRODUCTS INC

compliant

8542.39.00.01

Check for Price

Active

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

5.5 V

70 dB

COMMON OUTPUT

10 µA

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XQCC-N24

85 °C

-40 °C

NOT SPECIFIED

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NO LEAD

500 µm

QUAD

4 mm

800 µm

4 mm

N/A

2006-11-16

Check for Price

Active

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

5.5 V

1.8 V

INDUSTRIAL

S-XBGA-B25

COMMERCIAL

85 °C

-40 °C

260

NOT SPECIFIED

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

BALL

500 µm

BOTTOM

2.54 mm

670 µm

2.54 mm

ROCHESTER ELECTRONICS LLC

BGA

2.50 X 2.50 MM, LEAD FREE, UCSP-25

unknown

Check for Price

Yes

Obsolete

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XBGA-B25

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

VFBGA

BGA25,5X5,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.54 mm

670 µm

2.54 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

2.50 X 2.50 MM, ROHS COMPLIANT, UCSP-25

unknown

EAR99

8542.39.00.01

Check for Price

Transferred

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

5.5 V

70 dB

COMMON OUTPUT

10 µA

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XQCC-N24

85 °C

-40 °C

NOT SPECIFIED

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NO LEAD

500 µm

QUAD

4 mm

800 µm

4 mm

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

1 2 Next

Compare

MAX4947ETG+

Maxim Integrated Products

$4.7709

Yes

Transferred

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XQCC-N24

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

500 µm

QUAD

4 mm

800 µm

4 mm

MAXIM INTEGRATED PRODUCTS INC

QFN

4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGD-1, TQFN-24

compliant

EAR99

8542.39.00.01

MAX4947EBA+

Maxim Integrated Products

Check for Price

Yes

Obsolete

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XBGA-B25

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

VFBGA

BGA25,5X5,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.54 mm

670 µm

2.54 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA25,5X5,20

compliant

8542.39.00.01

MAX4947ERA+

Maxim Integrated Products

Check for Price

Yes

Obsolete

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

5.5 V

1.8 V

INDUSTRIAL

S-PBGA-B25

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.56 mm

690 µm

2.56 mm

MAXIM INTEGRATED PRODUCTS INC

VFBGA,

compliant

8542.39.00.01

MAX4947ETG+T

Maxim Integrated Products

Check for Price

Yes

Transferred

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XQCC-N24

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

500 µm

QUAD

4 mm

800 µm

4 mm

MAXIM INTEGRATED PRODUCTS INC

QFN

HVQCCN, LCC24,.16SQ,20

compliant

8542.39.00.01

MAX4947ETG+T

Analog Devices Inc

Check for Price

Yes

Active

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XQCC-N24

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

500 µm

QUAD

4 mm

800 µm

4 mm

24-LFCSP-4X4X0.75

2006-11-16

Analog Devices

MAX4947ERA+T

Maxim Integrated Products

Check for Price

Yes

Obsolete

DPDT

260

TIN SILVER COPPER

MAXIM INTEGRATED PRODUCTS INC

compliant

8542.39.00.01

MAX4947ETG/GG8

Analog Devices Inc

Check for Price

Active

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

5.5 V

70 dB

COMMON OUTPUT

10 µA

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XQCC-N24

85 °C

-40 °C

NOT SPECIFIED

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NO LEAD

500 µm

QUAD

4 mm

800 µm

4 mm

N/A

2006-11-16

MAX4947EBA+

Rochester Electronics LLC

Check for Price

Active

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

5.5 V

1.8 V

INDUSTRIAL

S-XBGA-B25

COMMERCIAL

85 °C

-40 °C

260

NOT SPECIFIED

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

BALL

500 µm

BOTTOM

2.54 mm

670 µm

2.54 mm

ROCHESTER ELECTRONICS LLC

BGA

2.50 X 2.50 MM, LEAD FREE, UCSP-25

unknown

MAX4947EBA+T

Maxim Integrated Products

Check for Price

Yes

Obsolete

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

70 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XBGA-B25

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

VFBGA

BGA25,5X5,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.54 mm

670 µm

2.54 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

2.50 X 2.50 MM, ROHS COMPLIANT, UCSP-25

unknown

EAR99

8542.39.00.01

MAX4947ETG/GG8

Maxim Integrated Products

Check for Price

Transferred

3 V

YES

5.5 Ω

300 mΩ

800 ns

DPDT

CMOS

5.5 V

70 dB

COMMON OUTPUT

10 µA

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-XQCC-N24

85 °C

-40 °C

NOT SPECIFIED

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NO LEAD

500 µm

QUAD

4 mm

800 µm

4 mm

MAXIM INTEGRATED PRODUCTS INC

compliant

EAR99

8542.39.00.01

1 2 Next