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MAX4889BETO+
Maxim Integrated Products
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$5.4015 | Yes | Yes | Transferred | 3.3 V | YES | 8.4 Ω | 200 mΩ | DPDT | CMOS | 2 | 4 | 15 dB | SEPARATE OUTPUT | 3.6 V | 3 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-XQCC-N42 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 42 | UNSPECIFIED | HVQCCN | LCC42,.14X.35,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 3.5 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3.50 X 9 MM, ROHS COMPLIANT, TQFN-42 | 42 | compliant | EAR99 | 8542.39.00.01 | ||||||||
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MAX4889BETO+T
Maxim Integrated Products
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Check for Price | Yes | Transferred | 3.3 V | YES | 8.4 Ω | 200 mΩ | DPDT | CMOS | 1.8 V | -300 mV | 2 | 4 | 15 dB | SEPARATE OUTPUT | 1 mA | 3.6 V | 3 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-XQCC-N42 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 42 | UNSPECIFIED | HVQCCN | LCC42,.14X.35,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 3.5 mm | MAXIM INTEGRATED PRODUCTS INC | TQFN-42 | compliant | |||||||||||
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MAX4889BETO+
Analog Devices Inc
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Check for Price | Yes | Active | 3.3 V | YES | 8.4 Ω | 200 mΩ | DPDT | CMOS | 2 | 4 | 15 dB | SEPARATE OUTPUT | 3.6 V | 3 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-XQCC-N42 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 42 | UNSPECIFIED | HVQCCN | LCC42,.14X.35,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 3.5 mm | ANALOG DEVICES INC | 42-LFCSP-3.5X9X0.75 | 3.50 X 9 MM, ROHS COMPLIANT, TQFN-42 | 42 | compliant | 42-LFCSP-3.5X9X0.75 | 2008-05-15 | Analog Devices | ||||||||
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MAX4889BETO+
Rochester Electronics LLC
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Check for Price | No | Active | 3.3 V | YES | 8.4 Ω | 200 mΩ | DPDT | CMOS | 2 | 4 | 15 dB | 3.6 V | 3 V | INDUSTRIAL | R-XQCC-N42 | COMMERCIAL | NOT SPECIFIED | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 42 | UNSPECIFIED | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NOT SPECIFIED | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 3.5 mm | ROCHESTER ELECTRONICS LLC | QFN | 3.50 X 9 MM, ROHS COMPLIANT, TQFN-42 | 42 | unknown | |||||||||||||||
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MAX4889BETO+T
Analog Devices Inc
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Check for Price | Yes | Active | 3.3 V | YES | 8.4 Ω | 200 mΩ | DPDT | CMOS | 1.8 V | -300 mV | 2 | 4 | 15 dB | SEPARATE OUTPUT | 1 mA | 3.6 V | 3 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-XQCC-N42 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 42 | UNSPECIFIED | HVQCCN | LCC42,.14X.35,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 9 mm | 800 µm | 3.5 mm | ANALOG DEVICES INC | 42-LFCSP-3.5X9X0.75 | TQFN-42 | 42 | compliant | 42-LFCSP-3.5X9X0.75 | 2008-05-15 | Analog Devices |