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Parametric » Signal Circuits » Multiplexers or Switches

Parametric results for: MAX4717EBC+T under Multiplexers or Switches

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Select Parts		Part Number

		MAX4717EBC+T Maxim Integrated Products
		MAX4717EBC-T Maxim Integrated Products
		MAX4717EBC+T Analog Devices Inc

				Most Relevant						Technical										Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Surface Mount	On-state Resistance-Max (Ron)	On-state Resistance Match-Nom	Switch-on Time-Max	Switch-off Time-Max	Analog IC - Other Type	Technology	Number of Channels	Number of Functions	Off-state Isolation-Nom	Output	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Switching	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Manufacturer Package Code	Date Of Intro	Samacsys Manufacturer

Yes

Yes

Transferred

3 V

YES

4.5 Ω

100 mΩ

80 ns

40 ns

SPDT

BICMOS

1

2

55 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

R-XBGA-B12

Not Qualified

e1

1

85 °C

-40 °C

260

30

12

UNSPECIFIED

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.02 mm

670 µm

1.54 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA12,3X4,20

12

compliant

EAR99

8542.39.00.01

Check for Price

No

No

Obsolete

3 V

YES

4.5 Ω

100 mΩ

80 ns

40 ns

SPDT

BICMOS

1

2

55 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

R-XBGA-B12

Not Qualified

e0

1

85 °C

-40 °C

245

12

UNSPECIFIED

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN LEAD

BALL

500 µm

BOTTOM

2.02 mm

670 µm

1.54 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

2 X 1.5 MM, UCSP-12

12

not_compliant

EAR99

8542.39.00.01

Check for Price

Yes

Active

3 V

YES

4.5 Ω

100 mΩ

80 ns

40 ns

SPDT

BICMOS

1

2

55 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

R-XBGA-B12

Not Qualified

e1

1

85 °C

-40 °C

260

30

12

UNSPECIFIED

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

2.02 mm

670 µm

1.54 mm

12-WLCSP-N/A

12

12-WLCSP-N/A

2002-11-24

Analog Devices

Compare

Signal Circuits

Maxim Integrated Products

Yes

Yes

Transferred

3 V

YES

4.5 Ω

100 mΩ

80 ns

40 ns

SPDT

BICMOS

1

2

55 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

R-XBGA-B12

Not Qualified

e1

1

85 °C

-40 °C

260

30

12

UNSPECIFIED

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.02 mm

670 µm

1.54 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA12,3X4,20

12

compliant

EAR99

8542.39.00.01

Signal Circuits

Maxim Integrated Products

Check for Price

No

No

Obsolete

3 V

YES

4.5 Ω

100 mΩ

80 ns

40 ns

SPDT

BICMOS

1

2

55 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

R-XBGA-B12

Not Qualified

e0

1

85 °C

-40 °C

245

12

UNSPECIFIED

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN LEAD

BALL

500 µm

BOTTOM

2.02 mm

670 µm

1.54 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

2 X 1.5 MM, UCSP-12

12

not_compliant

EAR99

8542.39.00.01

Analog Devices Inc

Check for Price

Yes

Active

3 V

YES

4.5 Ω

100 mΩ

80 ns

40 ns

SPDT

BICMOS

1

2

55 dB

SEPARATE OUTPUT

5.5 V

1.8 V

BREAK-BEFORE-MAKE

INDUSTRIAL

R-XBGA-B12

Not Qualified

e1

1

85 °C

-40 °C

260

30

12

UNSPECIFIED

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

2.02 mm

670 µm

1.54 mm

12-WLCSP-N/A

12

12-WLCSP-N/A

2002-11-24

Analog Devices