Filter Your Search
1 - 8 of 8 results
|
MAX4684EBC+T
Maxim Integrated Products
|
$3.4714 | Yes | Yes | Transferred | 3 V | YES | 800 mΩ | 60 mΩ | 60 ns | 40 ns | SPDT | BICMOS | 2 | 1 | 64 dB | SEPARATE OUTPUT | 3.3 V | 2.7 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PBGA-B12 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VFBGA | BGA12,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 2.02 mm | 670 µm | 1.54 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | VFBGA, BGA12,3X4,20 | 12 | compliant | EAR99 | 8542.39.00.01 | |||||
|
MAX4684EBC+
Maxim Integrated Products
|
Check for Price | Yes | Yes | Transferred | 3 V | YES | 800 mΩ | 60 mΩ | 50 ns | 30 ns | SPDT | 1 | 2 | 64 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PBGA-B12 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VFBGA | BGA12,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 2.02 mm | 650 µm | 1.52 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | VFBGA, BGA12,3X4,20 | 12 | compliant | EAR99 | 8542.39.00.01 | ||||||
|
MAX4684EBC-T
Rochester Electronics LLC
|
Check for Price | No | No | Active | 3 V | YES | 800 mΩ | 60 mΩ | 50 ns | 30 ns | SPDT | 1 | 2 | 64 dB | 5.5 V | 1.8 V | INDUSTRIAL | R-PBGA-B12 | 1 | 85 °C | -40 °C | 240 | 20 | 12 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | NOT SPECIFIED | BALL | 500 µm | BOTTOM | 2.02 mm | 670 µm | 1.54 mm | ROCHESTER ELECTRONICS LLC | BGA | 0.50 MM PITCH, UCSP-12 | 12 | unknown | |||||||||||||
|
MAX4684EBC-T
Maxim Integrated Products
|
Check for Price | No | No | Obsolete | 3 V | YES | 800 mΩ | 60 mΩ | 50 ns | 30 ns | SPDT | 1 | 2 | 64 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PBGA-B12 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 12 | PLASTIC/EPOXY | VFBGA | BGA12,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN LEAD | BALL | 500 µm | BOTTOM | 2.02 mm | 670 µm | 1.54 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 0.50 MM PITCH, UCSP-12 | 12 | not_compliant | EAR99 | 8542.39.00.01 | |||||||
|
MAX4684EBC+T
Analog Devices Inc
|
Check for Price | Yes | Active | 3 V | YES | 800 mΩ | 60 mΩ | 60 ns | 40 ns | SPDT | BICMOS | 2 | 1 | 64 dB | SEPARATE OUTPUT | 3.3 V | 2.7 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PBGA-B12 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VFBGA | BGA12,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 2.02 mm | 670 µm | 1.54 mm | 12-WLCSP-N/A | 12 | 12-WLCSP-N/A | 2001-01-03 | Analog Devices | ||||||||
|
MAX4684EBC+
Analog Devices Inc
|
Check for Price | Yes | Active | 3 V | YES | 800 mΩ | 60 mΩ | 50 ns | 30 ns | SPDT | 1 | 2 | 64 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PBGA-B12 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VFBGA | BGA12,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 2.02 mm | 650 µm | 1.52 mm | 12-WLCSP-N/A | 12 | 12-WLCSP-N/A | 2001-01-03 | Analog Devices | |||||||||
|
MAX4684EBC
Maxim Integrated Products
|
Check for Price | No | No | Obsolete | 3 V | YES | 800 mΩ | 60 mΩ | 50 ns | 30 ns | SPDT | 1 | 2 | 64 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PBGA-B12 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 12 | PLASTIC/EPOXY | VFBGA | BGA12,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN LEAD | BALL | 500 µm | BOTTOM | 2.02 mm | 670 µm | 1.54 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 0.50 MM PITCH, UCSP-12 | 12 | not_compliant | 8542.39.00.01 | ||||||||
|
MAX4684EBC
Rochester Electronics LLC
|
Check for Price | No | No | Active | 3 V | YES | 800 mΩ | 60 mΩ | 50 ns | 30 ns | SPDT | 1 | 2 | 64 dB | 5.5 V | 1.8 V | INDUSTRIAL | R-PBGA-B12 | 1 | 85 °C | -40 °C | 240 | 20 | 12 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | NOT SPECIFIED | BALL | 500 µm | BOTTOM | 2.02 mm | 670 µm | 1.54 mm | ROCHESTER ELECTRONICS LLC | BGA | 0.50 MM PITCH, UCSP-12 | 12 | unknown |