Parametric results for: MAX3946 under Other Telecom ICs
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MAX3946ETG+T
Maxim Integrated Products
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$8.2068 | Yes | Yes | Transferred | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N24 | e3 | 1 | 95 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | ROHS COMPLIANT, TQFN-24 | compliant | 8542.39.00.01 | |||||||||
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MAX3946ETG+
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N24 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | 4 X 4 MM, ROHS COMPLIANT, TQFN-24 | compliant | 8542.39.00.01 | QFN | 24 | EAR99 | |||||
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MAX3946ETG+
Analog Devices Inc
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Check for Price | Yes | Not Recommended | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N24 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | ANALOG DEVICES INC | 4 X 4 MM, ROHS COMPLIANT, TQFN-24 | compliant | 24-LFCSP-4X4X0.75 | 24 | 24-LFCSP-4X4X0.75 | 2010-03-18 | Analog Devices | |||||
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MAX3946ETG+T
Analog Devices Inc
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Check for Price | Yes | Not Recommended | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N24 | e3 | 1 | 95 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | ANALOG DEVICES INC | ROHS COMPLIANT, TQFN-24 | compliant | 24-LFCSP-4X4X0.75 | 24 | 24-LFCSP-4X4X0.75 | 2010-03-18 | Analog Devices |