Parametric results for: MAX3657ETC+ under Other Telecom ICs
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MAX3657ETC
Maxim Integrated Products
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Check for Price | No | Obsolete | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 34 µA | INDUSTRIAL | S-XQCC-N12 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 245 | 12 | UNSPECIFIED | HVQCCN | LCC12,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, MO-220C, TQFN-12 | 12 | not_compliant | EAR99 | 8542.33.00.01 | |||
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MAX3657ETC+
Maxim Integrated Products
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Check for Price | Yes | Obsolete | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N12 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 12 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 12 | compliant | EAR99 | 8542.33.00.01 | ||||
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MAX3657ETC-T
Maxim Integrated Products
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Check for Price | No | Obsolete | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | 34 µA | INDUSTRIAL | S-XQCC-N12 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 245 | 12 | UNSPECIFIED | HVQCCN | LCC12,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC12,.12SQ,20 | 12 | not_compliant | 8542.39.00.01 | ||||
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MAX3657ETC+T
Maxim Integrated Products
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Check for Price | Yes | Obsolete | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N12 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 12 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 12 | compliant | EAR99 | 8542.33.00.01 |