Findchips: Parametric Search Results for MAX3373EEBL+


Select Parts		Part Number

		MAX3373EEBL+T Maxim Integrated Products
		MAX3373EEBL-T Rochester Electronics LLC
		MAX3373EEBL Maxim Integrated Products
		MAX3373EEBL-T Maxim Integrated Products

				Most Relevant				Technical														Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Supply Voltage1-Nom	Output Characteristics	Number of Bits	Interface IC Type	Technology	Additional Feature	Delay-Max	Number of Functions	Output Latch or Register	Output Polarity	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage1-Max	Supply Voltage1-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

$2.2608

Yes

Transferred

1.8 V

3.3 V

OPEN-DRAIN

VOLTAGE LEVEL TRANSLATOR

BICMOS

1.6 µs

LATCH

TRUE

300 µA

5.5 V

1.2 V

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA9,3X3,20

compliant

EAR99

8542.39.00.01

Check for Price

Active

3.3 V

INTERFACE CIRCUIT

BICMOS

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

5.5 V

1.2 V

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

COMMERCIAL

85 °C

-40 °C

240

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

ROCHESTER ELECTRONICS LLC

BGA

1.50 X 1.50 MM, UCSP-9

unknown

Check for Price

Obsolete

INTERFACE CIRCUIT

BICMOS

YES

INDUSTRIAL

S-PBGA-B8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA8,3X3,20

SQUARE

GRID ARRAY, FINE PITCH

BALL

500 µm

BOTTOM

MAXIM INTEGRATED PRODUCTS INC

unknown

8542.39.00.01

Check for Price

Obsolete

3.3 V

INTERFACE CIRCUIT

BICMOS

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

5.5 V

1.2 V

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA9,3X3,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN LEAD

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA9,3X3,20

not_compliant

8542.39.00.01

Compare

MAX3373EEBL+T

Maxim Integrated Products

$2.2608

Yes

Transferred

1.8 V

3.3 V

OPEN-DRAIN

VOLTAGE LEVEL TRANSLATOR

BICMOS

1.6 µs

LATCH

TRUE

300 µA

5.5 V

1.2 V

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA9,3X3,20

compliant

EAR99

8542.39.00.01

MAX3373EEBL-T

Rochester Electronics LLC

Check for Price

Active

3.3 V

INTERFACE CIRCUIT

BICMOS

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

5.5 V

1.2 V

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

COMMERCIAL

85 °C

-40 °C

240

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

ROCHESTER ELECTRONICS LLC

BGA

1.50 X 1.50 MM, UCSP-9

unknown

MAX3373EEBL

Maxim Integrated Products

Check for Price

Obsolete

INTERFACE CIRCUIT

BICMOS

YES

INDUSTRIAL

S-PBGA-B8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA8,3X3,20

SQUARE

GRID ARRAY, FINE PITCH

BALL

500 µm

BOTTOM

MAXIM INTEGRATED PRODUCTS INC

unknown

8542.39.00.01

MAX3373EEBL-T

Maxim Integrated Products

Check for Price

Obsolete

3.3 V

INTERFACE CIRCUIT

BICMOS

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

5.5 V

1.2 V

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA9,3X3,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN LEAD

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA9,3X3,20

not_compliant

8542.39.00.01

Parametric results for: MAX3373EEBL+ under Other Interface ICs