Findchips: Parametric Search Results for MAX3372EEBL-T


Select Parts		Part Number

		MAX3372EEBL-T Maxim Integrated Products
		MAX3372EEBL-T Rochester Electronics LLC
		MAX3372EEBL+T Maxim Integrated Products
		MAX3372EEBL+T Rochester Electronics LLC

				Most Relevant				Technical													Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Supply Voltage1-Nom	Output Characteristics	Number of Bits	Interface IC Type	Technology	Additional Feature	Number of Functions	Output Latch or Register	Output Polarity	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage1-Max	Supply Voltage1-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

Obsolete

3.3 V

INTERFACE CIRCUIT

BICMOS

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

5.5 V

1.2 V

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA9,3X3,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN LEAD

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

1.50 X 1.50 MM, UCSP-9

not_compliant

8542.39.00.01

Check for Price

Yes

Active

3.3 V

INTERFACE CIRCUIT

BICMOS

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

5.5 V

1.2 V

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

COMMERCIAL

85 °C

-40 °C

240

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

ROCHESTER ELECTRONICS LLC

BGA

1.50 X 1.50 MM, UCSP-9

unknown

Check for Price

Yes

Obsolete

1.8 V

3.3 V

OPEN-DRAIN

VOLTAGE LEVEL TRANSLATOR

BICMOS

LATCH

TRUE

300 µA

5.5 V

1.2 V

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

UCSP-9

compliant

8542.39.00.01

Check for Price

Active

3.3 V

INTERFACE CIRCUIT

BICMOS

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

COMMERCIAL

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN LEAD

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

ROCHESTER ELECTRONICS LLC

BGA

1.50 X 1.50 MM, UCSP-9

unknown

Compare

MAX3372EEBL-T

Maxim Integrated Products

Check for Price

Obsolete

3.3 V

INTERFACE CIRCUIT

BICMOS

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

5.5 V

1.2 V

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA9,3X3,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN LEAD

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

1.50 X 1.50 MM, UCSP-9

not_compliant

8542.39.00.01

MAX3372EEBL-T

Rochester Electronics LLC

Check for Price

Yes

Active

3.3 V

INTERFACE CIRCUIT

BICMOS

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

5.5 V

1.2 V

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

COMMERCIAL

85 °C

-40 °C

240

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

ROCHESTER ELECTRONICS LLC

BGA

1.50 X 1.50 MM, UCSP-9

unknown

MAX3372EEBL+T

Maxim Integrated Products

Check for Price

Yes

Obsolete

1.8 V

3.3 V

OPEN-DRAIN

VOLTAGE LEVEL TRANSLATOR

BICMOS

LATCH

TRUE

300 µA

5.5 V

1.2 V

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA9,3X3,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

UCSP-9

compliant

8542.39.00.01

MAX3372EEBL+T

Rochester Electronics LLC

Check for Price

Active

3.3 V

INTERFACE CIRCUIT

BICMOS

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

5.5 V

1.65 V

YES

INDUSTRIAL

S-PBGA-B9

COMMERCIAL

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN LEAD

BALL

500 µm

BOTTOM

1.52 mm

670 µm

1.52 mm

ROCHESTER ELECTRONICS LLC

BGA

1.50 X 1.50 MM, UCSP-9

unknown

Parametric results for: MAX3372EEBL-T under Other Interface ICs