Findchips: Parametric Search Results for MAX3355EEBC-T


Select Parts		Part Number

		MAX3355EEBC-T Maxim Integrated Products
		MAX3355EEBC+T Rochester Electronics LLC
		MAX3355EEBC-T Rochester Electronics LLC
		MAX3355EEBC+T Maxim Integrated Products

				Most Relevant						Technical				Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Technology	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price Buy

Obsolete

3 V

2.6 V

5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

BICMOS

INDUSTRIAL

R-PBGA-B12

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

500 µm

BOTTOM

1.54 mm

2.12 mm

670 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

UCSP-12

not_compliant

EAR99

8542.39.00.01

Check for Price Buy

Yes

Active

3 V

2.6 V

5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

BICMOS

INDUSTRIAL

R-PBGA-B12

COMMERCIAL

85 °C

-40 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

NOT SPECIFIED

BALL

500 µm

BOTTOM

1.54 mm

2.12 mm

650 µm

ROCHESTER ELECTRONICS LLC

BGA

UCSP-12

unknown

Check for Price Buy

Yes

Active

3 V

2.6 V

5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

BICMOS

INDUSTRIAL

R-PBGA-B12

COMMERCIAL

85 °C

-40 °C

240

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

NOT SPECIFIED

BALL

500 µm

BOTTOM

1.54 mm

2.12 mm

670 µm

ROCHESTER ELECTRONICS LLC

BGA

UCSP-12

unknown

Check for Price Buy

Yes

Obsolete

3 V

2.6 V

5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

BICMOS

INDUSTRIAL

R-PBGA-B12

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.54 mm

2.12 mm

650 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

UCSP-12

compliant

EAR99

8542.39.00.01

Compare

MAX3355EEBC-T

Maxim Integrated Products

Check for Price Buy

Obsolete

3 V

2.6 V

5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

BICMOS

INDUSTRIAL

R-PBGA-B12

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

500 µm

BOTTOM

1.54 mm

2.12 mm

670 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

UCSP-12

not_compliant

EAR99

8542.39.00.01

MAX3355EEBC+T

Rochester Electronics LLC

Check for Price Buy

Yes

Active

3 V

2.6 V

5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

BICMOS

INDUSTRIAL

R-PBGA-B12

COMMERCIAL

85 °C

-40 °C

260

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

NOT SPECIFIED

BALL

500 µm

BOTTOM

1.54 mm

2.12 mm

650 µm

ROCHESTER ELECTRONICS LLC

BGA

UCSP-12

unknown

MAX3355EEBC-T

Rochester Electronics LLC

Check for Price Buy

Yes

Active

3 V

2.6 V

5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

BICMOS

INDUSTRIAL

R-PBGA-B12

COMMERCIAL

85 °C

-40 °C

240

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

NOT SPECIFIED

BALL

500 µm

BOTTOM

1.54 mm

2.12 mm

670 µm

ROCHESTER ELECTRONICS LLC

BGA

UCSP-12

unknown

MAX3355EEBC+T

Maxim Integrated Products

Check for Price Buy

Yes

Obsolete

3 V

2.6 V

5.5 V

YES

POWER SUPPLY SUPPORT CIRCUIT

BICMOS

INDUSTRIAL

R-PBGA-B12

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.54 mm

2.12 mm

650 µm

MAXIM INTEGRATED PRODUCTS INC

BGA

UCSP-12

compliant

EAR99

8542.39.00.01

Parametric results for: MAX3355EEBC-T under Power Management Circuits