Parametric results for: MAX326 under Microcontrollers
Filter Your Search
1 - 10 of 357 results
|
Select parts from the table below to compare.
Compare
Compare
|
|
MAX32660GWE+
Maxim Integrated Products
|
$0.5304 | Yes | Transferred | 32 | 96 MHz | 98.5 MHz | 10 | YES | 1.8 V | MICROCONTROLLER, RISC | NO | YES | NO | YES | 3.63 V | 1.71 V | e2 | 1 | 260 | 30 | 16 | BGA | SQUARE | GRID ARRAY | TIN SILVER COPPER NICKEL | BALL | 350 µm | BOTTOM | 1.6 mm | 1.6 mm | MAXIM INTEGRATED PRODUCTS INC | BGA, | compliant | 3A991.A.2 | 8542.31.00.01 | 2018-02-09 | ||||||||||||||||||||||||||||||||||
|
|
MAX32660GTG+
Maxim Integrated Products
|
$3.0120 | Yes | Transferred | 32 | 96 MHz | 98.5 MHz | 14 | YES | 1.8 V | MICROCONTROLLER, RISC | NO | YES | NO | YES | 3.63 V | 1.71 V | e3 | 1 | 260 | 30 | 24 | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | compliant | 3A991.A.2 | 8542.31.00.01 | ||||||||||||||||||||||||||||||||||||
|
|
MAX32664GWEA+
Maxim Integrated Products
|
$3.4160 | Yes | Transferred | e2 | 1 | 260 | 30 | TIN SILVER COPPER NICKEL | MAXIM INTEGRATED PRODUCTS INC | , | compliant | 3A991.A.2 | 8542.31.00.01 | 2018-06-22 | ANALOG CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
MAX32670GTL+
Maxim Integrated Products
|
$3.4514 | Yes | Transferred | MICROCONTROLLER, RISC | e3 | 1 | 260 | 30 | MATTE TIN | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.31.00.01 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
MAX32660GTP+
Maxim Integrated Products
|
$3.4851 | Yes | Transferred | 32 | 96 MHz | 98.5 MHz | 14 | YES | 1.8 V | MICROCONTROLLER, RISC | NO | YES | NO | YES | 3.63 V | 1.71 V | e3 | 1 | 260 | 30 | 20 | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | compliant | 3A991.A.2 | 8542.31.00.01 | 2018-02-09 | |||||||||||||||||||||||||||||||||||
|
|
MAX32626ITK+
Maxim Integrated Products
|
$4.8413 | Yes | Transferred | 32 | 96 MHz | 524288 | 163840 | 32 kHz | 40 | YES | 1.2 V | MICROCONTROLLER, RISC | CMOS | ALSO REQUIRES 1.8V NOM SUPPLY | NO | YES | YES | 8 | YES | FLASH | 1.26 V | 1.14 V | OTHER | S-XQCC-N68 | e3 | 3 | 85 °C | -30 °C | 260 | 30 | 68 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 400 µm | QUAD | 800 µm | 8 mm | 8 mm | MAXIM INTEGRATED PRODUCTS INC | TQFN-68 | compliant | 8542.31.00.01 | 2016-10-28 | |||||||||||||||||||||||
|
|
MAX32662GTJ+
Analog Devices Inc
|
$5.2129 | Yes | Active | 32 | 100 MHz | 262144 | 81920 | CORTEX-M4 | 32 MHz | 21 | 5 | YES | 900 mV | MICROCONTROLLER, RISC | CMOS | Also Operates with 1V and 1.1V Nom Supply | NO | NO | YES | FLOATING POINT | YES | YES | YES | 4 | 3 | 8 | 8 | YES | FLASH | 945 mV | 855 mV | S-XQCC-N32 | e3 | 1 | 105 °C | -40 °C | 260 | NOT SPECIFIED | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 800 µm | 5 mm | 5 mm | ANALOG DEVICES INC | compliant | 3A991.A.2 | 8542.31.00.01 | 2023-03-20 | 32-LFCSP-5X5X0.75 | 32 | 32-LFCSP-5X5X0.75 | Analog Devices | ||||||||||
|
MAX3268CUB+
Maxim Integrated Products
|
$5.2404 | Yes | Yes | Obsolete | YES | 3.3 V | BIPOLAR | 1 | 62 µA | COMMERCIAL | S-PDSO-G10 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 10 | PLASTIC/EPOXY | HTSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 1.1 mm | 3 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | LEAD FREE, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | compliant | EAR99 | 8542.33.00.01 | TSSOP | 10 | TELECOM CIRCUIT | ||||||||||||||||||||||||||||||||
|
MAX3264CUE+
Maxim Integrated Products
|
$5.6970 | Yes | Yes | Obsolete | YES | 3.3 V | BIPOLAR | 1 | 62 µA | COMMERCIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HTSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 1.1 mm | 4.4 mm | 5 mm | MAXIM INTEGRATED PRODUCTS INC | HTSSOP, TSSOP16,.25 | compliant | EAR99 | 8542.33.00.01 | TSSOP | 16 | TELECOM CIRCUIT | ||||||||||||||||||||||||||||||||
|
|
MAX32625IWY+
Maxim Integrated Products
|
$6.0361 | Yes | Transferred | 32 | 96 MHz | 524288 | 163840 | 32 kHz | 40 | YES | 1.2 V | MICROCONTROLLER, RISC | CMOS | ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED | NO | YES | YES | 8 | YES | FLASH | 1.26 V | 1.14 V | OTHER | R-PBGA-B63 | e2 | 1 | 85 °C | -30 °C | 260 | 30 | 63 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER NICKEL | BALL | 400 µm | BOTTOM | 690 µm | 3.068 mm | 3.868 mm | MAXIM INTEGRATED PRODUCTS INC | VFBGA, | compliant | 8542.31.00.01 | 2016-10-28 |