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Parametric » Signal Circuits » Other Signal Circuits

Parametric results for: MAX2688EWS+T under Other Signal Circuits

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Select Parts		Part Number

		MAX2688EWS+T Analog Devices Inc
		MAX2688EWS+T Maxim Integrated Products
		MAX2688EWS+T10 Maxim Integrated Products

				Most Relevant		Technical						Compliance		Operating Conditions					Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Surface Mount	Analog IC - Other Type	Technology	Number of Functions	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Part Package Code	Pin Count	Manufacturer Package Code	Date Of Intro	Samacsys Manufacturer	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Active

2.85 V

YES

ANALOG CIRCUIT

BICMOS

1

3.3 V

1.6 V

INDUSTRIAL

S-PBGA-B4

1

85 °C

-40 °C

260

30

4

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

840 µm

690 µm

840 µm

4-WLCSP-N/A

4

4-WLCSP-N/A

2010-08-13

Analog Devices

Check for Price

Yes

Yes

Transferred

2.85 V

YES

ANALOG CIRCUIT

BICMOS

1

3.3 V

1.6 V

INDUSTRIAL

S-PBGA-B4

e2

1

85 °C

-40 °C

260

30

4

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

840 µm

690 µm

840 µm

BGA

4

MAXIM INTEGRATED PRODUCTS INC

VFBGA,

compliant

EAR99

8542.33.00.01

Check for Price

Yes

Yes

Obsolete

2.85 V

YES

ANALOG CIRCUIT

BICMOS

1

3.3 V

1.6 V

INDUSTRIAL

S-PBGA-B4

e2

1

85 °C

-40 °C

260

30

4

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

840 µm

690 µm

840 µm

MAXIM INTEGRATED PRODUCTS INC

VFBGA,

compliant

8542.39.00.01

Compare

Analog Devices Inc

Check for Price

Yes

Active

2.85 V

YES

ANALOG CIRCUIT

BICMOS

1

3.3 V

1.6 V

INDUSTRIAL

S-PBGA-B4

1

85 °C

-40 °C

260

30

4

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

840 µm

690 µm

840 µm

4-WLCSP-N/A

4

4-WLCSP-N/A

2010-08-13

Analog Devices

Signal Circuits

Maxim Integrated Products

Check for Price

Yes

Yes

Transferred

2.85 V

YES

ANALOG CIRCUIT

BICMOS

1

3.3 V

1.6 V

INDUSTRIAL

S-PBGA-B4

e2

1

85 °C

-40 °C

260

30

4

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

840 µm

690 µm

840 µm

BGA

4

MAXIM INTEGRATED PRODUCTS INC

VFBGA,

compliant

EAR99

8542.33.00.01

Maxim Integrated Products

Check for Price

Yes

Yes

Obsolete

2.85 V

YES

ANALOG CIRCUIT

BICMOS

1

3.3 V

1.6 V

INDUSTRIAL

S-PBGA-B4

e2

1

85 °C

-40 °C

260

30

4

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

840 µm

690 µm

840 µm

MAXIM INTEGRATED PRODUCTS INC

VFBGA,

compliant

8542.39.00.01