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Parametric » Telecommunication Circuits » ATM/SONET/SDH ICs

Parametric results for: MAX24305EXG+ under ATM/SONET/SDH ICs

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Select Parts		Part Number

		MAX24305EXG+ Microsemi Corporation
		MAX24305EXG+ Microchip Technology Inc
		MAX24305EXG2 Microsemi Corporation
		MAX24305EXG2 Microchip Technology Inc

			Most Relevant	Technical						Compliance		Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Telecom IC Type	Additional Feature	Applications	Number of Functions	Supply Current-Max	Temperature Grade	JESD-30 Code	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code	Samacsys Manufacturer

Yes

Transferred

1.8 V

ATM/SONET/SDH SUPPORT CIRCUIT

1

INDUSTRIAL

S-PBGA-B81

85 °C

-40 °C

260

30

81

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

10 mm

10 mm

1.47 mm

MICROSEMI CORP

BGA

10 X 10 MM, ROHS COMPLIANT, CSBGA-81

81

compliant

8542.39.00.01

Microsemi Corporation

Yes

Active

1.8 V

ATM/SONET/SDH SUPPORT CIRCUIT

1

INDUSTRIAL

S-PBGA-B81

85 °C

-40 °C

260

30

81

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

10 mm

10 mm

1.47 mm

MICROCHIP TECHNOLOGY INC

10 X 10 MM, ROHS COMPLIANT, CSBGA-81

compliant

Check for Price

Yes

Transferred

e1

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

MICROSEMI CORP

compliant

8542.39.00.01

Microsemi Corporation

Check for Price

Yes

Active

1.8 V

ATM/SONET/SDH SUPPORT CIRCUIT

3.3 V NOMINAL ALSO AVAILABLE

SONET;SDH

1

441 mA

INDUSTRIAL

S-PBGA-B81

e1

85 °C

-40 °C

81

PLASTIC/EPOXY

LBGA

BGA81,9X9,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

10 mm

10 mm

1.47 mm

MICROCHIP TECHNOLOGY INC

CSBGA-81

compliant

Compare

Telecommunication Circuits

Microsemi Corporation

Yes

Transferred

1.8 V

ATM/SONET/SDH SUPPORT CIRCUIT

1

INDUSTRIAL

S-PBGA-B81

85 °C

-40 °C

260

30

81

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

10 mm

10 mm

1.47 mm

MICROSEMI CORP

BGA

10 X 10 MM, ROHS COMPLIANT, CSBGA-81

81

compliant

8542.39.00.01

Microsemi Corporation

Microchip Technology Inc

Yes

Active

1.8 V

ATM/SONET/SDH SUPPORT CIRCUIT

1

INDUSTRIAL

S-PBGA-B81

85 °C

-40 °C

260

30

81

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

YES

BALL

1 mm

BOTTOM

10 mm

10 mm

1.47 mm

MICROCHIP TECHNOLOGY INC

10 X 10 MM, ROHS COMPLIANT, CSBGA-81

compliant

Microsemi Corporation

Check for Price

Yes

Transferred

e1

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

MICROSEMI CORP

compliant

8542.39.00.01

Microsemi Corporation

Microchip Technology Inc

Check for Price

Yes

Active

1.8 V

ATM/SONET/SDH SUPPORT CIRCUIT

3.3 V NOMINAL ALSO AVAILABLE

SONET;SDH

1

441 mA

INDUSTRIAL

S-PBGA-B81

e1

85 °C

-40 °C

81

PLASTIC/EPOXY

LBGA

BGA81,9X9,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

10 mm

10 mm

1.47 mm

MICROCHIP TECHNOLOGY INC

CSBGA-81

compliant