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MAX19588ETN+D
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3.3 V | 2.56 V | 1 | 16 | 100 MHz | YES | ADC, PROPRIETARY METHOD | 1 | 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 56 | UNSPECIFIED | HVQCCN | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 8 mm | 800 µm | 8 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC56,.31SQ,20 | 56 | compliant | 3A001.A.5.A.5 | 8542.39.00.01 | |||||
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MAX19588ETN-D
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | 2.56 V | 1 | 16 | 100 MHz | YES | ADC, PROPRIETARY METHOD | 1 | 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N56 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 56 | UNSPECIFIED | HVQCCN | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 8 mm | 800 µm | 8 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC56,.31SQ,20 | 56 | not_compliant | 3A001.A.5.A.5 | 8542.39.00.01 | |||||||
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MAX19588ETN+D
Analog Devices Inc
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Check for Price | Yes | Active | 3.3 V | 2.56 V | 1 | 16 | 100 MHz | YES | ADC, PROPRIETARY METHOD | 1 | 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 56 | UNSPECIFIED | HVQCCN | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 8 mm | 800 µm | 8 mm | 56-LFCSP-8X8X0.75 | 56 | 56-LFCSP-8X8X0.75 | 2006-05-23 | Analog Devices |