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Parametric » Signal Circuits » Multiplexers or Switches

Parametric results for: MAX14594EEWL+T under Multiplexers or Switches

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Select Parts		Part Number

		MAX14594EEWL+T Maxim Integrated Products
		MAX14594EEWL+T Analog Devices Inc

				Most Relevant						Technical														Compliance		Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Surface Mount	On-state Resistance-Max (Ron)	On-state Resistance Match-Nom	Switch-on Time-Max	Switch-off Time-Max	Analog IC - Other Type	Technology	Input Voltage-Max	Input Voltage-Min	Normal Position	Number of Channels	Number of Functions	Off-state Isolation-Nom	Output	Supply Current-Max (Isup)	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Switching	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count	Manufacturer Package Code	Date Of Intro	Samacsys Manufacturer

Check for Price

Yes

Yes

Transferred

2.5 V

YES

380 mΩ

5 mΩ

10 ms

2.25 ms

DPDT

BICMOS

5.5 V

-5.5 V

NC

2

1

60 dB

COMMON OUTPUT

60 µA

5.5 V

1.6 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-PBGA-B9

e2

1

85 °C

-40 °C

260

30

9

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.26 mm

690 µm

1.26 mm

MAXIM INTEGRATED PRODUCTS INC

WLP-9

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Active

2.5 V

YES

380 mΩ

5 mΩ

10 ms

2.25 ms

DPDT

BICMOS

5.5 V

-5.5 V

NC

2

1

60 dB

COMMON OUTPUT

60 µA

5.5 V

1.6 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-PBGA-B9

1

85 °C

-40 °C

260

30

9

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.26 mm

690 µm

1.26 mm

ANALOG DEVICES INC

WLP-9

compliant

9-WLCSP-N/A

9

9-WLCSP-N/A

2012-07-17

Analog Devices

Compare

Maxim Integrated Products

Check for Price

Yes

Yes

Transferred

2.5 V

YES

380 mΩ

5 mΩ

10 ms

2.25 ms

DPDT

BICMOS

5.5 V

-5.5 V

NC

2

1

60 dB

COMMON OUTPUT

60 µA

5.5 V

1.6 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-PBGA-B9

e2

1

85 °C

-40 °C

260

30

9

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.26 mm

690 µm

1.26 mm

MAXIM INTEGRATED PRODUCTS INC

WLP-9

compliant

EAR99

8542.39.00.01

Analog Devices Inc

Check for Price

Yes

Active

2.5 V

YES

380 mΩ

5 mΩ

10 ms

2.25 ms

DPDT

BICMOS

5.5 V

-5.5 V

NC

2

1

60 dB

COMMON OUTPUT

60 µA

5.5 V

1.6 V

BREAK-BEFORE-MAKE

INDUSTRIAL

S-PBGA-B9

1

85 °C

-40 °C

260

30

9

PLASTIC/EPOXY

VFBGA

BGA9,3X3,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.26 mm

690 µm

1.26 mm

ANALOG DEVICES INC

WLP-9

compliant

9-WLCSP-N/A

9

9-WLCSP-N/A

2012-07-17

Analog Devices