Findchips: Parametric Search Results for MAX1304

Parametric results for: MAX1304 under Other Interface ICs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		MAX13042EEBC+T Maxim Integrated Products
		MAX13047EEVB+T Maxim Integrated Products
		MAX13046EELT+T Analog Devices Inc
		MAX13043EEBC+T Maxim Integrated Products
		MAX13044EETD+T Maxim Integrated Products
		MAX13044EEBC+ Maxim Integrated Products
		MAX13047EEVB+T Analog Devices Inc
		MAX13042EEBC+T Analog Devices Inc
		MAX13042EETD+ Maxim Integrated Products
		MAX1304ECM+ Maxim Integrated Products

				Most Relevant			Technical									Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Supply Voltage1-Nom	Number of Bits	Interface IC Type	Technology	Number of Functions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage1-Max	Supply Voltage1-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Manufacturer Package Code	Date Of Intro	Samacsys Manufacturer	Analog Input Voltage-Max	Analog Input Voltage-Min	Conversion Time-Max	Converter Type	Linearity Error-Max (EL)	Number of Analog In Channels	Output Bit Code	Output Format	Sample Rate	Sample and Hold / Track and Hold

$0.8771

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

R-PBGA-B12

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.12 mm

670 µm

1.54 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA12,3X4,20

compliant

EAR99

8542.39.00.01

$1.9318

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.6 V

1.1 V

5.5 V

1.65 V

YES

INDUSTRIAL

R-XQCC-N10

85 °C

-40 °C

260

UNSPECIFIED

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

NICKEL PALLADIUM GOLD

NO LEAD

400 µm

QUAD

1.8 mm

550 µm

1.4 mm

MAXIM INTEGRATED PRODUCTS INC

VQCCN,

compliant

EAR99

8542.39.00.01

$3.7441

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.6 V

1.1 V

5.5 V

1.65 V

YES

INDUSTRIAL

R-PDSO-N6

85 °C

-40 °C

260

PLASTIC/EPOXY

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

Gold/Nickel (Au/Ni)

NO LEAD

500 µm

DUAL

1.5 mm

800 µm

1 mm

ANALOG DEVICES INC

6-LFCSP-1.5X1X0.75

1.50 X 1 MM, ROHS COMPLIANT, UDFN-6

compliant

6-LFCSP-1.5X1X0.75

2008-05-22

Analog Devices

Check for Price

Yes

Obsolete

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

R-PBGA-B12

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.12 mm

670 µm

1.54 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA12,3X4,20

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-PDSO-N14

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HVSON

SOLCC14,.12,16

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

400 µm

DUAL

3 mm

800 µm

3 mm

MAXIM INTEGRATED PRODUCTS INC

DFN

HVSON, SOLCC14,.12,16

compliant

8542.39.00.01

Check for Price

Yes

Transferred

BICMOS

YES

INDUSTRIAL

R-PBGA-B12

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, FINE PITCH

Matte Tin (Sn)

BALL

500 µm

BOTTOM

MAXIM INTEGRATED PRODUCTS INC

FBGA, BGA12,3X4,20

compliant

8542.39.00.01

Check for Price

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.6 V

1.1 V

5.5 V

1.65 V

YES

INDUSTRIAL

R-XQCC-N10

85 °C

-40 °C

260

UNSPECIFIED

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

400 µm

QUAD

1.8 mm

550 µm

1.4 mm

10-LFCSP-1.4X1.8X0.5

2008-05-22

Analog Devices

Check for Price

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

R-PBGA-B12

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

2.12 mm

670 µm

1.54 mm

12-WLCSP-N/A

2007-05-15

Analog Devices

Check for Price

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-PDSO-N14

85 °C

-40 °C

260

PLASTIC/EPOXY

HVSON

SOLCC14,.12,16

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

400 µm

DUAL

3 mm

800 µm

3 mm

MAXIM INTEGRATED PRODUCTS INC

3 X 3 MM, 0.80 MM HEIGHT, LEAD FREE, TDFN-14

compliant

Check for Price

Yes

Transferred

5 V

BICMOS

YES

INDUSTRIAL

S-PQFP-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFQFP

TQFP48,.35SQ

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

MATTE TIN

GULL WING

500 µm

QUAD

7 mm

1.6 mm

7 mm

MAXIM INTEGRATED PRODUCTS INC

QFP

7 X 7 MM, ROHS COMPLIANT, LQFP-48

compliant

EAR99

8542.39.00.01

5 V

1.98 µs

ADC, PROPRIETARY METHOD

0.0244 %

OFFSET BINARY, 2'S COMPLEMENT BINARY

PARALLEL, WORD

456 kHz

TRACK

1 2 3 4 5 Next

Compare

MAX13042EEBC+T

Maxim Integrated Products

$0.8771

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

R-PBGA-B12

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.12 mm

670 µm

1.54 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA12,3X4,20

compliant

EAR99

8542.39.00.01

MAX13047EEVB+T

Maxim Integrated Products

$1.9318

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.6 V

1.1 V

5.5 V

1.65 V

YES

INDUSTRIAL

R-XQCC-N10

85 °C

-40 °C

260

UNSPECIFIED

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

NICKEL PALLADIUM GOLD

NO LEAD

400 µm

QUAD

1.8 mm

550 µm

1.4 mm

MAXIM INTEGRATED PRODUCTS INC

VQCCN,

compliant

EAR99

8542.39.00.01

MAX13046EELT+T

Analog Devices Inc

$3.7441

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.6 V

1.1 V

5.5 V

1.65 V

YES

INDUSTRIAL

R-PDSO-N6

85 °C

-40 °C

260

PLASTIC/EPOXY

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

Gold/Nickel (Au/Ni)

NO LEAD

500 µm

DUAL

1.5 mm

800 µm

1 mm

ANALOG DEVICES INC

6-LFCSP-1.5X1X0.75

1.50 X 1 MM, ROHS COMPLIANT, UDFN-6

compliant

6-LFCSP-1.5X1X0.75

2008-05-22

Analog Devices

MAX13043EEBC+T

Maxim Integrated Products

Check for Price

Yes

Obsolete

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

R-PBGA-B12

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

2.12 mm

670 µm

1.54 mm

MAXIM INTEGRATED PRODUCTS INC

BGA

VFBGA, BGA12,3X4,20

compliant

EAR99

8542.39.00.01

MAX13044EETD+T

Maxim Integrated Products

Check for Price

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-PDSO-N14

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HVSON

SOLCC14,.12,16

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

400 µm

DUAL

3 mm

800 µm

3 mm

MAXIM INTEGRATED PRODUCTS INC

DFN

HVSON, SOLCC14,.12,16

compliant

8542.39.00.01

MAX13044EEBC+

Maxim Integrated Products

Check for Price

Yes

Transferred

BICMOS

YES

INDUSTRIAL

R-PBGA-B12

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, FINE PITCH

Matte Tin (Sn)

BALL

500 µm

BOTTOM

MAXIM INTEGRATED PRODUCTS INC

FBGA, BGA12,3X4,20

compliant

8542.39.00.01

MAX13047EEVB+T

Analog Devices Inc

Check for Price

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.6 V

1.1 V

5.5 V

1.65 V

YES

INDUSTRIAL

R-XQCC-N10

85 °C

-40 °C

260

UNSPECIFIED

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

400 µm

QUAD

1.8 mm

550 µm

1.4 mm

10-LFCSP-1.4X1.8X0.5

2008-05-22

Analog Devices

MAX13042EEBC+T

Analog Devices Inc

Check for Price

Yes

Active

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

R-PBGA-B12

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA12,3X4,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

2.12 mm

670 µm

1.54 mm

12-WLCSP-N/A

2007-05-15

Analog Devices

MAX13042EETD+

Maxim Integrated Products

Check for Price

Yes

Transferred

1.8 V

3.3 V

INTERFACE CIRCUIT

BICMOS

3.2 V

1.62 V

3.6 V

2.2 V

YES

INDUSTRIAL

S-PDSO-N14

85 °C

-40 °C

260

PLASTIC/EPOXY

HVSON

SOLCC14,.12,16

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

400 µm

DUAL

3 mm

800 µm

3 mm

MAXIM INTEGRATED PRODUCTS INC

3 X 3 MM, 0.80 MM HEIGHT, LEAD FREE, TDFN-14

compliant

MAX1304ECM+

Maxim Integrated Products

Check for Price

Yes

Transferred

5 V

BICMOS

YES

INDUSTRIAL

S-PQFP-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFQFP

TQFP48,.35SQ

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

MATTE TIN

GULL WING

500 µm

QUAD

7 mm

1.6 mm

7 mm

MAXIM INTEGRATED PRODUCTS INC

QFP

7 X 7 MM, ROHS COMPLIANT, LQFP-48

compliant

EAR99

8542.39.00.01

5 V

1.98 µs

ADC, PROPRIETARY METHOD

0.0244 %

OFFSET BINARY, 2'S COMPLEMENT BINARY

PARALLEL, WORD

456 kHz

TRACK

1 2 3 4 5 Next