Parametric results for: MAX1278ETC+ under Analog to Digital Converters
Filter Your Search
1 - 6 of 6 results
|
Select parts from the table below to compare.
Compare
Compare
|
|
MAX1278ETC+T
Analog Devices Inc
|
Check for Price | Yes | Active | 5 V | 2.053 V | 1 | 0.0305 % | 12 | 1.8 MHz | 556 ns | YES | ADC, SUCCESSIVE APPROXIMATION | -2.043 V | 1 | 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | SERIAL | S-XQCC-N12 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | UNSPECIFIED | HVQCCN | LCC12,.16SQ,32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 800 µm | QUAD | 4 mm | 800 µm | 4 mm | 12-LFCSP-4X4X0.75 | 12 | 12-LFCSP-4X4X0.75 | 2004-08-23 | |||||||||
|
MAX1278ETC+
Maxim Integrated Products
|
Check for Price | Yes | Yes | Transferred | 5 V | 4.106 V | 1 | 0.0305 % | 12 | 1.8 MHz | 556 ns | YES | ADC, SUCCESSIVE APPROXIMATION | 1 | BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | SERIAL | S-XQCC-N12 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | UNSPECIFIED | HVQCCN | LCC12,.16SQ,32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 800 µm | QUAD | 4 mm | 800 µm | 4 mm | QFN | 12 | MAXIM INTEGRATED PRODUCTS INC | 4 X 4 MM, 0.80 MM HEIGHT, MO-220-WGGB, TQFN-12 | compliant | EAR99 | 8542.39.00.01 | ||||||
|
|
MAX1278ETC
Maxim Integrated Products
|
Check for Price | No | No | Obsolete | 5 V | 4.096 V | 1 | 0.03 % | 12 | YES | A/D CONVERTER | 1 | OFFSET BINARY | BICMOS | INDUSTRIAL | S-PQCC-N12 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 12 | PLASTIC/EPOXY | QCCN | LCC12,.16SQ,32 | SQUARE | CHIP CARRIER | TIN LEAD | NO LEAD | 800 µm | QUAD | MAXIM INTEGRATED PRODUCTS INC | QCCN, LCC12,.16SQ,32 | not_compliant | EAR99 | 8542.39.00.01 | |||||||||||||||||
|
|
MAX1278ETC+
Analog Devices Inc
|
Check for Price | Yes | Active | 5 V | 4.106 V | 1 | 0.0305 % | 12 | 1.8 MHz | 556 ns | YES | ADC, SUCCESSIVE APPROXIMATION | 1 | BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | SERIAL | S-XQCC-N12 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | UNSPECIFIED | HVQCCN | LCC12,.16SQ,32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 800 µm | QUAD | 4 mm | 800 µm | 4 mm | 12-LFCSP-4X4X0.75 | 12 | 12-LFCSP-4X4X0.75 | 2004-08-23 | ANALOG DEVICES INC | 4 X 4 MM, 0.80 MM HEIGHT, MO-220-WGGB, TQFN-12 | compliant | Analog Devices | ||||||
|
|
MAX1278ETC-T
Maxim Integrated Products
|
Check for Price | No | No | Obsolete | 5 V | 4.106 V | 1 | 0.0305 % | 12 | 1.8 MHz | 556 ns | YES | ADC, SUCCESSIVE APPROXIMATION | 1 | BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | SERIAL | S-XQCC-N12 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 12 | UNSPECIFIED | HVQCCN | LCC12,.16SQ,32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 800 µm | QUAD | 4 mm | 800 µm | 4 mm | QFN | 12 | MAXIM INTEGRATED PRODUCTS INC | HVQCCN, LCC12,.16SQ,32 | not_compliant | 8542.39.00.01 | |||||||||
|
|
MAX1278ETC+T
Maxim Integrated Products
|
Check for Price | Yes | Yes | Transferred | 5 V | 2.053 V | 1 | 0.0305 % | 12 | 1.8 MHz | 556 ns | YES | ADC, SUCCESSIVE APPROXIMATION | -2.043 V | 1 | 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | SERIAL | S-XQCC-N12 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | UNSPECIFIED | HVQCCN | LCC12,.16SQ,32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 800 µm | QUAD | 4 mm | 800 µm | 4 mm | QFN | 12 | MAXIM INTEGRATED PRODUCTS INC | HVQCCN, LCC12,.16SQ,32 | compliant | EAR99 | 8542.39.00.01 |