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MAX1195ECM+D
Maxim Integrated Products
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$6.2605 | Yes | Yes | Transferred | 3 V | 2 | 0.3906 % | 8 | 40 MHz | YES | ADC, FLASH METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, 8 BITS | S-PQFP-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | 7 X 7 MM, 1 MM HEIGHT, ROHS COMPLIANT, EXPOSED PAD, MS-026ABC-HD, TQFP-48 | 48 | compliant | EAR99 | 8542.39.00.01 | |||||||
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MAX1195ECM+TD
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3 V | 2 | 0.3906 % | 8 | 40 MHz | YES | ADC, FLASH METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, 8 BITS | S-PQFP-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | HTFQFP, | 48 | compliant | 8542.39.00.01 | ||||||||||
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MAX1195ECM+D
Analog Devices Inc
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Check for Price | Yes | Active | 3 V | 2 | 0.3906 % | 8 | 40 MHz | YES | ADC, FLASH METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, 8 BITS | S-PQFP-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | ANALOG DEVICES INC | 48-TQFP_EP-7X7X1.0 | 7 X 7 MM, 1 MM HEIGHT, ROHS COMPLIANT, EXPOSED PAD, MS-026ABC-HD, TQFP-48 | 48 | compliant | 48-TQFP_EP-7X7X1.0 | 2002-05-16 | ||||||||
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MAX1195ECM
Maxim Integrated Products
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Check for Price | No | Obsolete | 3 V | 1 V | 2 | 0.3906 % | 8 | 40 MHz | YES | ADC, FLASH METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, 8 BITS | S-PQFP-G48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | HTFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | TIN LEAD | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | 7 X 7 MM, 1 MM HEIGHT, EXPOSED PAD, MO-136, TQFP-48 | 48 | not_compliant | 8542.39.00.01 | ||||||||
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MAX1195ECM-T
Maxim Integrated Products
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Check for Price | No | Obsolete | 3 V | 1 V | 2 | 0.3906 % | 8 | 40 MHz | YES | ADC, FLASH METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, 8 BITS | S-PQFP-G48 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | TIN LEAD | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | 7 X 7 MM, 1 MM HEIGHT, EXPOSED PAD, MO-136, TQFP-48 | 48 | not_compliant | 8542.39.00.01 | |||||||||
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MAX1195ECM-TD
Maxim Integrated Products
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Check for Price | No | Obsolete | 3 V | 2 | 0.3906 % | 8 | 40 MHz | YES | ADC, FLASH METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, 8 BITS | S-PQFP-G48 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | TIN LEAD | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | HTFQFP, | 48 | compliant | 8542.39.00.01 | |||||||||||
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MAX1195ECM+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 3 V | 1 V | 2 | 0.3906 % | 8 | 40 MHz | YES | ADC, FLASH METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, 8 BITS | S-PQFP-G48 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | TFQFP, | 48 | compliant | 8542.39.00.01 | ||||||||
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MAX1195ECM-D
Maxim Integrated Products
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Check for Price | No | Obsolete | 3 V | 2 | 0.3906 % | 8 | 40 MHz | YES | ADC, FLASH METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, 8 BITS | S-PQFP-G48 | Not Qualified | e0 | 85 °C | -40 °C | 240 | 20 | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | TIN LEAD | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | HTFQFP, | 48 | not_compliant | EAR99 | 8542.39.00.01 | |||||||||
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MAX1195ECM
Rochester Electronics LLC
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Check for Price | No | No | Active | 3 V | 1 V | 2 | 0.3906 % | 8 | 40 MHz | YES | ADC, FLASH METHOD | -1 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | CMOS | INDUSTRIAL | PARALLEL, 8 BITS | S-PQFP-G48 | e0 | 3 | 85 °C | -40 °C | 240 | 20 | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | TIN LEAD | GULL WING | 500 µm | QUAD | 7 mm | 1.2 mm | 7 mm | ROCHESTER ELECTRONICS LLC | QFP | 7 X 7 MM, 1 MM HEIGHT, EXPOSED PAD, MO-136, TQFP-48 | 48 | unknown |